20250122_K-1_Chakraborty.PDF

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1、Accelerating AI Chip Development with 3D Multi-Die Designs Chiplet Summit KeynoteAbhijeet Chakraborty,VP EngineeringJanuary 22,2025 2025 Synopsys,Inc.Agenda1.AI Chips The Next Growth Driver2.Essential Multi-Die Innovations for AI Chips3.Ecosystem Impact4.Outlook/Predictions 2025 Synopsys,Inc.1958Glo

2、bal Semiconductor Sales1($B)60 years198519901995200020052010201520202025E2030E 8-9 yearsGreat RecessionDotcom BubbleCOVID$1T+$0.5T1.Sources:SIA/WSTS(historicals);forecasts based on Gartner,TechInsights,IBS,SIA/WSTS and consensus analyst forecasts for leading semiconductor companies2.Sources:Gartner,

3、AMD,Nvidia,Intel,Goldman Sachs Web6%CAGRMobile 4%CAGRPC18%CAGR8%-10%CAGRPervasiveIntelligenceIOT&Cloud 6%CAGRIncreased Adoption Driven by Demand for AI Chips100%of AI Chips for Data Centers will be Multi-Die DesignsExplosion Growth inAI Silicon$400B29%CAGRChiplet Market$148B by 2028 at 86.7%CAGR 202

4、5 Synopsys,Inc.Multi-Die Design InnovationsFrom Keystone CompaniesAMDInstinct MI300AI Accelerator304 GPUs,256GB HBM3ESource:AMDNVIDIABlackwellAI Superchip72-core CPU,H100 TensorGPU,96GB HBM3/144GB HBM3ESource:NVIDIAMicrosoftAzure MaiaAI Accelerator105B Transistors,1.8TB/s HBM2E Source:MicrosoftIntel

5、Gaudi 3AI Accelerator 64 Tensor Processor Cores,128GB HBM Source:Intel 2025 Synopsys,Inc.Predicting Rapid Adoption of Multi-Die DesignsChiplet Market$411B by 2035ServerOthersAutomotiveMobilePCsTelecommunications.5G,IoTSource:IDtechExUS Dollars in BillionDistinct Chiplets$107B by 2033 at 42.57%CAGR3.

6、1107.02324252627282930313233012010080604020CPUMemorySensorGPUNetworkingSource:market.us 2025 Synopsys,Inc.AI Chips 2025 Synopsys,Inc.Need for More Data Transmission at Faster Rates Multi-die designs enable performance scalingLarge&complex AI workloads require more memory&compute scalingRemoving AI p