面向硅到系统先进封装的AI驱动多物理场分析.pdf

1、AI-Driven Multiphysics Analysis for Silicon-to-System Advanced PackagingAnsysPart of Synopsys Open Compute Project(OCP)APAC Summit AI-Driven Multiphysics Analysis for Silicon-to-System Advanced PackagingBenson Wei,Ph.D.Senior Director/AnsysCHIPLETS AND ADVANCED PACKAGING/PHOTONICSOutline4321Evolutio

2、n of Design ComplexityAdvance Packaging ChallengesCase StudyConclusionEM/IRThermalOpticsRadiationReliabilityMechanicalMultiphysics19801990200020102015202020251-2Sub-micronDeep submicronNanometerSub 100nm5/3 nm2/1.6 nmTransistor-levelGate-levelASICSoC/SiPStacked DieAdv.PackageComplex 3DICEvolution of

3、 Design Complexity!FunctionalKevin Zhang,TSMC ISSCC 2024 keynoteTimingFunctionalPowerTimingFunctionalStructurePowerTimingFunctionalThermalStructurePowerTimingFunctionalRadiationRadiationThermalStructureEM/IRTimingFunctionalMechanicalRadiationStructureEM/IRTimingFunctionalMechanicalOpticsThermalAdvan

4、ce Packaging Challenge:Aggressive System Scaling and complexityT.Singh,et al.,AMD,ISSCC,2025Courtesy of TSMC,2024Kevin Zhang,TSMC,ISSCC keynote,2024Analytical modeling of TSVs incl.TSV-to-TSV coupling for large-scale Si interposers with 1000s of TSVs Billions of connections,Signal routing,cross talk

5、,power integrity Distributed model for each TSV with resistance and inductance split above and below the substrate Liner oxide coupling to substrate is included in the modelTSVs are essential in 3DIC systems due to their impact on signal integrity,power delivery efficiency,and thermal dissipation.Mo

6、del of coupling between neighboring TSVsEquivalent circuit of TSV pair3D mesh of TSVAdvance Packaging Challenge:Singal,Power Integrity and HeatersA.,Smith,et al.,(2024).AMD Instinct MI300 Series Modular Chiplet Package HPC ad AI Accelerator for Exa-class Systems,ISSCCAdvance Packaging Challenge:Ther