专题讨论：人工智能时代的芯片技术：机遇与挑战.pdf

1、Panel:Panel:ChipletChiplet Technology in the AI Era:Technology in the AI Era:Opportunities and ChallengesOpportunities and ChallengesDIGITIMESAugust 6,2025 3:15pm-4:00pmPanel:Panel:ChipletChiplet Technology in the AI Era:Technology in the AI Era:Opportunities and ChallengesOpportunities and Challeng

2、esModerator:Eric HuangVice President/DIGITIMESC.K.PengC.K.PengSr.Director,Data Center Sr.Director,Data Center MediaTekMediaTekDr.Lihong Dr.Lihong C CaoaoSr.Director,Engineering&Sr.Director,Engineering&Technical MarketingTechnical MarketingASEASEPanel:Panel:ChipletChiplet Technology in the AI Era:Tec

3、hnology in the AI Era:Opportunities and ChallengesOpportunities and ChallengesTony LinTony LinVice PresidentVice PresidentSynopsys TaiwanSynopsys TaiwanDr.Dr.Shang Y.HouShang Y.HouDirector of High Performance Packaging Director of High Performance Packaging Integration DivisionIntegration DivisionTS

4、MCTSMC(By Company Alphabet)This panel focuses on the challenges and opportunities presented by chiplet-based heterogeneous integration,driven by the rise of AI and HPC applications.It will also explore the potential for building an open ecosystem across the semiconductor industry.Discussions will sp

5、an the entire value chainfrom system and chiplet design,wafer fabrication,advanced packaging,testing,equipment,to materialsaddressing key technical,market,and industry-related issues.ThemeTheme:本座談著眼於：在 AI/HPC應用驅動下，chiplet 異質整合相關產業所面臨的挑戰與機會，及打造開放的產業生態系的可能性。涵蓋從系統及chiplet 設計、晶圓製造、封裝、測試、設備、材料等各環節，就技術、市

6、場與產業多面向的重要議題進行探討。Compared to advanced wafer manufacturing,how do you see the role of advanced packaging and innovative chip interconnect technologies evolving within the semiconductor ecosystem?What value do they bring,and what market opportunities do they open up?Key Issues to E