OCP模块化标准（DC_MHS）——一个强大的行业转折点.pdf

1、OCP Modularity StandardsMHS:A powerful industry inflection pointSean Varley-Chief EvangelistAmpere ComputingOCP Modularity StandardsMHS:A powerful industry inflection pointSean VarleyChief Evangelist /Ampere Computing SERVERMHS VisionOld Platform ApproachNew Platform ModelModularity Delivers:Scalabi

2、lityFlexibilityCost EfficiencyTraditional Wisdom MHSAlong Comes the Age of AIThe way it wasThe ForecastMarket Size(Si,Systems,SW,Manageability)$5-7X BiggerPower Consumption2-4X more in 5 yearsComputational PlatformRack/ClusterServerVertical integration currently dominates AI More Processing More Net

3、working More Storage Higher Thermal Density Direct Liquid Cooling Custom Vertical Integration40%45%15%Edge InferencingData Center InferencingTrainingThe worlds AI infrastructure is currently optimized to train Large Batch Size Strict high precision Uniform SW Stack Long Steady State Runs Throughput

4、over timeTrainingInference Small Batch Size Relaxed precision Diverse SW Stack Lumpy or Spikey Runs Real-time biasedCPU Platformshttps:/ PlatformsCPU+GPU PlatformsForecasted AI by 2027AI is not one thing AI will be everywhereEmbedded DevicesEdge ServicesRegional Data CenterCore Data CenterMajor Cons

5、traintsSmall Form FactorsEnergy Supply&RackRack&Power DensityPower CapacityForm Factors1000s100s100100Modularity&Large Ecosystem of Solutions ProvidersDriving the next AI build out requiresMHS comes at the right timeMassive Diversification of Computing Platforms&SuppliersIntelAMDThe way it wasThe wa

6、y it isIntelAMDAmpere&other ArmNVIDIACustomHyper-scalerOtherAcceleratorsCompute complexity is increasing with AI More Power Delivery Higher Thermal Densities Greater Security and RoT More Cooling Options More Compute,Transistors,I/O Higher Speed Networking More Peripheral Compone