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高效大容量储能冷却创新.pdf

上传人: 明**** 编号:1011573 2025-12-21 15页 1.04MB

1、AI Driven Mass Storage AI Driven Mass Storage Interface UpgradeInterface UpgradeSeagateAI Driven Mass Storage Interface UpgradeMohamad El-BatalTechnologist/Seagate OCTOSTORAGEHigh Density HDD Storage Main Pain Points Acoustic noise contamination in high-density HDD storage enclosures during max envi

2、ronmental temperatures&fan-fail conditions causes significant increase in fan-RPM,which translates into near fan higher track errors&higher AFR Reducing fans RPM to reduce errors and save fan-power OPEX leads to lower-density chassis or higher and less-uniform HDD temperatures,which negatively impac

3、ts AFR and TCO Future heads&media with higher HDD areal and track densities will be even more susceptible to acoustic noise contamination and extreme temperature impact on AFRAir-Cooled High-Density Storage Pros&ConsProsConsSimple traditional designs work for Enterprise or OCP cold/hot aislesHDDs cl

4、oser to the fans experience damaging acoustic noiseReasonable Ashre Ambient-Temp cooling infrastructure Uneven HDD temperature distribution across high-density chassis19”or 21”Vertical Rack support with low-cost sheet-metal chassisCompute nodes are way hotter than storage exist in common racksFlexib

5、le CRU/FRU easy hot/cold-swap service supportCo-located higher power controller CRUs are always a challengeAt 10W per drive low-pressure/low-velocity airflow is manageableHigh-Density chassis added fan power consumption is significantOCP AirflowEnterprise AirflowImmersion Cooled High-Density Storage

6、 Pros&ConsProsConsNo acoustic noise to cause drive errorsHDD and Controller CRUs/FRUs are much harder to serviceSuperior HDD temperature distribution and better AFRSome negative impact on some electronics,contacts and labelsHigher power storage controllers can be easily accommodatedRequires storage

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全文主要探讨了高密度硬盘存储系统中的散热问题和解决方案。以下为关键点: 1. 高密度硬盘存储面临的主要问题: - 高温环境下风扇转速增加导致扇区错误和更高的平均故障间隔时间(AFR)。 - 降低风扇转速以减少错误和节省运营成本(OPEX)会导致硬盘温度不均匀,影响AFR和总拥有成本(TCO)。 2. 高密度存储的冷却方案: - 传统空气冷却:简单但存在噪音和温度分布不均问题。 - 液冷方案:无噪音,温度分布好,但成本高,需要重新设计存储机架。 3. 冷板/热腔设计: - 热腔板的热导率比铜高10倍。 - 液冷技术需要重大基础设施改变,但可降低存储失败率和提高TCO。 4. 设计模拟结果: - 目标是使硬盘温度保持在45°C以下。 - 通过冷板和热腔设计,可以实现更低的硬盘温度和更均匀的温度分布。 5. 未来展望: - 随着硬盘密度增加,冷板和热腔技术将更加重要。 - 鼓励参与OCP探索数据中心冷却基础设施的统一方案。
"高密度存储噪音难题解?" "水冷存储,效率革命?" "未来数据中心,如何降温?"
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