面向未来的冷却解决方案：泵送两相冷却解决方案的进步.pdf

1、The Cooling Solution for the Next Era:Advancements in the Pumped Two-Phase SolutionsWistron CorporationKen LC ChengEngineer/Wistron CorporationFrank H ChenDeputy Executive Director/Wistron CorporationThe Cooling Solution for the Next Era:Advancements in the Pumped Two-Phase SolutionsCOOLING ENVIRONM

2、ENTSOutline54312Comparison Between a Single-Phase System and a Two-Phase System Difficulties in a Two-Phase SystemStatus of Pumped Two-Phase Cooling TechnologySummaryIncreasing Requirements for Heat Dissipation GPU power and local heat flux increases exponentially According to the trend,local hot-sp

3、ot heat flux may approach 4 W/mm2by 2027 and exceed 6W/mm2by 2030Increasing Requirements for Heat DissipationPower(W)Heat Flux(W/mm2)More difficult to keep junction temperature within specification due to(1)Heterogeneous integration:Less area for heat dissipation(due to more local hot spots)(2)2.5D

4、and 3D architectures:Longer thermal path There needs to be a more efficient thermal solutionIncreasing Requirements for Heat DissipationReference:TSMC,https:/ Phase vs Single PhasePROS&CONSPumped Two-Phase CoolingDLCAir CoolingHeat Flux4x2x1xRack Power Density4.4x2.8x1xPumped Power 1x N/ASaving 65%T

5、wo Phase vs Single PhaseNo.No.ItemItemCompatibilityCompatibility1Cold Plate2CDUX3Tubing4Primary Loop5Leakage SensorX6StorageXFrom PG25 to Refrigerant:the compatible configurations:Inheritable:Some Parts ReplacedX:Needs New Set-UpDifficulties in Pumped Two-Phase CoolingWhat challenges must be address

6、ed?Instability Instability-different heating rates correspond to different flow patterns-different flow patterns result in various flowrate instabilitiesMaintenanceMaintenance-more stringent safety requirementsReference:H.Liu,W.Liu,D.Chen,H.Liu,J.Qin,P.Yan,P.Li,Experimental inves