通过先进的包装创意推动人工智能发展.pdf

1、Propelling AI forward through Advanced Packaging CreativityYin ChangASE,Inc.OCP APAC/August 5,2025Taipei,TaiwanAI IS HEREAI applications permeating global life,creating new efficiencies and new markets,from data center to edge devices.AI economy projected to soar from$189 billion in 2023 to$4.8 tril

2、lion by 2033 a 25-fold increase in just a decade AI adoption could boost global GDP by 15%by 2035,based on game-changing capabilities and safe deployment.Unprecedented data generation is driving global datasphere trajectory towards 200ZB by 2030HEALTHCARETELECOMMUNICATIONSRETAILFINANCIAL SERVICES2So

3、urce:UN Trade and Development(UNCTAD),PwC,IDC 2025Multimodal AISystems to mimick human ability to process diverse sensoryTrending AI models generating dataAgentic AISystems that exhibit autonomy,proactivity,learn and the ability to act independently.3ASE Confidential ProprietaryGrowing Demands and C

4、hallenges in AI EraPerformanceMemoryPowerThermalArea2x 7xincreased computeworkload2x-10 x network bandwidth&memory capacity3 kW thermal coolingsExascale 21 mW to zettascale 500mW power delivery2x10 x reticle 2x-6x Pkg size(20120)5High Performance Demands by AI IndustryAcross all domains of AI,datase

5、t size for train models doubles every 6 months with tens of trillions wordsHigh-performance compute to train models grew 4-5x yearly 2024 with 1.6x/year increase chip quantity&1.6x/year improvement in performance per chip3.7x/yearSize of datasets 6.7x/year4.2x/yearSuper compute performanceSource Epo

6、ch AI6Memory Bandwidth Trend for AIEpoch AIMemory&interconnect bandwidth(1.4x/2year)slower than compute capability(3.1x/2year)Memory access delays(Memory Wall)cannot meet demands of compute,creating performance&SI challengesMemory bandwidth bottleneck drives more HBM&DRAM,increasing power and module