用于单相和两相芯片直接液冷的一体式防漏冷板.pdf

1、Unibody Leakproof Cold Plates for Single-and Two-Phase Direct-to-Chip Liquid CoolingPoh Seng(PS)Lee,Ph.D,ASME FellowHead and Professor,Department of Mechanical EngineeringExecutive Director,Energy Studies Institute(ESI)Coordinating-Director,NUS Energy Solutions Hub(NESH)Co-Director,NUS Sustainable F

2、uturesNational University of SingaporeandFounder&Director,CoolestDCOutline54321Unibody Leakproof Cold PlateAM Cold Plates for Single Phase CoolingTwo-Phase Direct-to-Chip Liquid CoolingSustainable Tropical Data Centre TestbedOutlook and OpportunitiesUnibody Leakproof Cold PlateConventional cold plat

3、e designPotential issue:Leakage concernTop cover:CNC machinedRubber gasket:For sealingCold plate:Wire-cut finsIntegrated leak-free designFirst iteration:Second iteration:Split-flowAM-optimised:Split-flow with inlet headerScrews:For sealingCPU Cold PlateCentre impinging split-flow with inlet headerIn

4、let header with guide vanes for flow distributionOblique finsGPU Cold PlateAir-cooled lattice structures for cooling of VRMsCentre impinging split-flowLiquid flow channels for cooling of VRAMsGPU image from:Hybrid Cold Plate1.3D modelAir-cooled oblique finsLiquid-cooled OTFA*Unibody structure realis

5、ed with metal additive manufacturing3.Final print for mass production*Pressure tested up to 3 bar2.Test print prototype*Single-Phase Cold Plate Simulation ResultsPump breakdown condition with trickling flow of water-Only clocking EPYC 7413 at 68.6%of 180W TDP with hybrid heat sink at full fan speed

6、and junction temperature maintains at 80C.Pump breakdown conditionOverclocking EPYC 7413 with hybrid heat sink is possible-Junction temperature maintains at 29.5C,water flow rate can be further reduced.To maintain chip temp at 58C,SC:11 10-4WOTFA:1.8 10-4WSavings:83.6%Simulation