推进数据中心创新：面向可扩展性能和无缝兼容性的架构.pdf

1、Advancing Data Center Innovation:Advancing Data Center Innovation:Architectures Designed for Scalable Architectures Designed for Scalable Performance and Seamless CompatibilityPerformance and Seamless CompatibilityIntelAdvancing Data Center Innovation:Architectures Designed for Scalable Performance

2、and Seamless CompatibilityJatin Upadhyay Vice President,Platform Engineering GroupGeneral Manager,Customer and Systems EngineeringIntelSERVERDesign Challenges in Modern Data Centers and&AI Architecture Innovation PillarsAdvancing Technology Together OutlineDesign Challenges in Data Centers&AI Archit

3、ectureNodeRackCluster ServiceCluster&Data Center ScaleInnovation PillarsThermal and Power AdvancingThermal and Power AdvancingPCB Design&Signal IntegrityPCB Design&Signal IntegrityMemory&High Speed IOMemory&High Speed IORack/Cluster Software Rack/Cluster Software LPDDRLow-Power Double Data RateInnov

4、ation Pillar:MemoryHBMHigh-bandwidth memoryDDR6 12800 MT/sMRDIMMGen.1:8800 MT/s Gen.2:12800 MT/s Gen3.:16 GT/sAdvancing to HighAdvancing to High-Speed,HighSpeed,High-Capacity DDR for Data Center&AI ApplicationsCapacity DDR for Data Center&AI ApplicationsInnovation Pillar:High Speed Interconnects(PCI

5、e)LPDDRLow-Power Double Data RateEscalating Challenges with Tighter Loss Margins at 2x FrequencyEscalating Challenges with Tighter Loss Margins at 2x FrequencyDesign&Initiatives Risk AssessmentInterconnect Eco.EnablePassive ChannelElectrical ValidationPower Delivery EvolutionGeneral SVR General SVR

6、2 kW2 kWAI SVR AI SVR 1010 15 kW15 kW48V Rack 48V Rack 120 250kW120 250kWHVDC HVDC 800 kW 1.2MW800 kW 1.2MWFocusing from HPM Voltage Regulator(VR)through AI Server to Rack PWR Solution Focusing from HPM Voltage Regulator(VR)through AI Server to Rack PWR Solution Innovating from Board to Rack:Advanci