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加速人工智能从半导体到数据中心基础设施的转型.pdf

上传人: 明**** 编号:1011497 2025-12-21 14页 1.51MB

1、Accelerating AI from Semiconductor to Data Center InfrastructureWai Chung NgaiDirector,APJ Field Application Engineering/AMDOCP APAC Project LeadSERVERAI Innovation is acceleratingHigh Performance&Adaptive ComputingAccelerate AI Compute PerformanceOAM Universal Baseboard(OAM-UBB)Optimize AI Performa

2、nce with High Performance CPULiquid Cooling Support High Power and Improve EfficiencyOpen Standard Network:Scale-out and Scale-UpUltra Accelerator Link Engineering to ScaleAMD ROCm Deeping Ecosystem CollaborationOpen Source:Feature Velocity&Leadership PerformanceUsing AMD InstinctMI355X vs.B200Optimized AI Rack Solutions on Open Industry Standard DesignAccelerating AI from Semiconductor to Data CenterThank You!http:/

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