由 CoWoS 和 COUPE 集成的先进 CPO.pdf

1、TSMC PropertyAdvanced CPO Integrated by CoWoSand COUPES.Y.Hou,TSMCTSMC PropertyAdvanced CPO Integrated by CoWoSand COUPEDr.Shang Y.HouDirector,High Performance Packaging IntegrationTSMCCHIPLETS AND ADVANCED PACKAGING/PHOTONICSTSMC PropertyHeterogeneous chiplet integrationCoWoSCOUPECPO based on CoWoS

2、 and COUPEForward-looking of CPO packagingOutlineTSMC PropertyTechnology Advancement for Performance Boost200 MOS TransistorsCu/Low-KSiGeImmersionHKMG2000cores7B 3000 Cores(16FF)15B TRANSISTORS A Few TransistorsLow-R BarrierELK2P2E3D FinFETCo Cap/LinerSelf-Aligned Line w/Flexible SpaceMetal Oxide ES

3、LEUVNew Channel MaterialsLow Damage/Hardening Low-K&Novel Cu FillChiplet and Heterogeneous IntegrationLogic150BLogicTRANSISTORSTimePerformanceEnabled by TSMC 3DFabricTechnologiesSource:TSMCTSMC PropertyA versatile 2.5D packaging technology for heterogeneous chipletintegration CoWoSPlatform for HPC A

4、I ApplicationsSiliconInterposerSoC/SoICHBMSubstrateCoWoS-SCoWoS-LCoWoS-RCoWoSChip LastLogic+HBM/LogicRDL Interposer+LSISoC/SoICHBMSubstrateRDLInterposerSoC/SoICHBMSubstrateLSISource:TSMCTSMC PropertyCoWoSEnables AI Compute ScalingInterposer SizeCoWoS-S1.5-reticleN16 SoC4 HBM2CoWoS-S2-reticleN7 SoC6

5、HBM2ECoWoS-S3.3-reticleN5 SoC/SoIC8 HBM3CoWoS-L/R3.3-reticleN3 SoC8 HBM3CoWoS-R1.4-reticleN5 SoC2 HBM2CoWoS-SCoWoS-L/R1 reticle 830mm2CoWoS-L/R5.5-reticleN3/N2 SoC/SoIC12 HBM3E/4CoWoS-L9.5-reticleA16 SoC/SoIC 12 HBM4E23242526201627HBMHBMHBMHBMHBMHBMHBMHBMHBMHBMHBMHBMSoCSoCIOIOHBMHBMHBMHBMHBMHBMHBMHB

6、MSoCSoCSource:TSMCTSMC PropertyBased onTSMC-SoICstacking technology to integrate advanced logic(EIC)on PIC to form an optical engineSmall footprint,high power efficiency,and excellent performance in electrical and optical.COUPE:COmpact Universal Photonic EnginePICEICStackingCOUPETSMC-SoICBond:EIC di