从边缘到云端：定制ASIC释放数据中心AI创新潜力.pdf

1、Custom ASIC Unleashing Datacenter AIMEDIATEKC.K.PengSr.Marketing Director,Datacenter,MediaTekCustom ASIC Unleashing Datacenter AICHIPLETS AND ADVANCED PACKAGING/PHOTONICSOutline 4321Cloud Market overviewCustom Silicon ComplexityMediaTek ASIC Service LeadershipMediaTek Nvdia Partnershipper yearC O M

2、P U T I N G R E Q U I R E M E N TWhat challenges lie ahead for silicon to keep pace with these demands?Source:Nvidia GTC 2024APPLICATIONS/WORKLOADSPERFORMANCE/WATTGeneral PurposeCPUGPUDomain Specific ASICSource:Meta/Omdia 2024OEOEOEOEOEOEOEOEOECustomHBMCompute DieCompute DieCompute DieCompute DieIO

3、DieIO DieCPCCPCCPCCPCCPCCPCCPCCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMOEOEOEOEOEOEOEOEOEOEOEOEOEOEGen2CPOGen1CPO300Gb requires CPC,and 400Gb requires CPO An increased#lanes requires a denser pitchDenser IP(Short loss)Denser pitchBall fanout

4、limitationLarger SerDes IP(High loss,better xtalk)Denser pitchSerDes IPNext gen xPUs400Gb x 200 lanes(64T)Interconnect bandwidth perCPO is requiredLive demonstrations from MWC 2025 and Computex 2025MediaTek ASIC EVBsMediaTek ASIC ICsHeterogeneous Integration 12.8Tbps 400G-DR4 compliant 112Gbps LR SE

5、RDES Direct drive Serviceability Options w/external and internal lasersMediaTeks PICMediaTek in-house PIC Socketed solution for serviceability with detachable connector.Co-Packaged CopperCo-Packaged OpticsMulti-kilowatt Power DeliveryIntegrated ControllersSystem Technology Co-OptimizationCoWoS S/R/L

6、Large 120nm x 150nm PackagesRick TsaiVice Chairman&CEO,MediaTekDTCO to Deliver Improved PPA and YieldN3P/N2P/A16AutomotiveSupercomputerIoTCloud ASICCompute NodeHost CPUHost I/FAI ComputeAI xPUAI xPUAI xPUAI xPUAI xPUAI xPUAI xPUAI xPUDPUHost Eth N/WStorage SSD