2.5D集成架构综述：EDA视角.pdf

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1、The Survey of 2.5D Integrated Architecture:An EDA PerspectiveShixin Chen1,Hengyuan Zhang2,Zichao Ling2,Jianwang Zhai2,Bei Yu11The Chinese University of Hong Kong2Beijing University of Posts and TelecommunicationsJan.21,20251Why 2.5D?2EDA for 2.5D Architecture Design3Partition and Interconnection4EDA

2、 for 2.5D IC Physical Design5Conclusion2/26Outline2/26Why 2.5D?3/26Fig 1.LLM is widely used and in high demand.Huge amount of parameters:GPT-3 has 175 billion parameters.Inference computation:Inference requires dozens of high-performance GPUs.Training process:Thousands of NVIDIA V100 GPUs are needed

3、 for training.How can we improve computational capabilities?4/26LLM and Computation Demand4/26More advanced tech-nodes:The commercial benefit is decreased after 28 nm.More computation resource:Wafer-scale chip is expensiveMore advanced architecture:3D IC or 2.5D ICFig 2.Moores law and the chip area

4、wall.11Yang Hu,Xinhan Lin,et al.(2024).“Wafer-Scale Computing:Advancements,Challenges,andFuture Perspectives Feature”.In:IEEE Circuits and Systems Magazine 24.1,pp.5281.5/26Computation Ability of IC5/26ChipletChipletChipletPackageHeat SinkTIM1u-BumpC4 BumpBGAInterposer TIM2RoutingFig 3.2.5D packageF

5、ig 4.2.5D and 3D hybrid package6/262.5D vs 3D Package6/26Manufacturing Complexity:2.5D:interposer for multiple chips;3D:advanced techniques like TSVs.Thermal Management:2.5D:heat dissipation on flat layout;3D:overheating from stacked chips(e.g.,multiple DRAM layers).Manufacturing Yield:2.5D:defects

6、in chip dont affect others;3D:defect in any chip can lead to totalpackage failure.Fig 5.(a)substrate-based,(b)silicon-based,and(c)RDL-based packages(bump:m)7/262.5D vs 3D Package7/26EDA tools are essential for IC design,while the tools for 2.5D are still in development.Architecture DesignPhysicalDes