西门子Simcenter MicReD在功率器件热阻及功率循环测试的解决方案.pdf

1、Thermal Reliability Test Solutions of Power DevicesPCIM Asia 2024 in ShenZhen ChinaBasiCAE：Yihao Wang15323483323Jones_ Introduction to Thermal Reliability of Power DevicesIntroduction to Thermal Reliability of Power Devices Micreds Solution for Thermal Resistance and Power Cycle Micreds Solution for

2、 Thermal Resistance and Power Cycle Testing of Power DevicesTesting of Power Devices The Effect of Applying Different Cycle Strategies in Power The Effect of Applying Different Cycle Strategies in Power Cycles on Test LifetimeCycles on Test LifetimePart I Introduction to Thermal Reliability of Power

3、 DevicesTypesHigh power module deviceApplication of Structural Functions-Reliability and Service LifeBond wire degradation over increasing cyclesReliability-Monitoring system or component degradation over time Determine where the defect occurs in the hot stack Identifying changes in failure over tim

4、e This analysis is completed before the component completely failsTechnology Market及Siemens PLMFocus on the reliability of power electronic device modulesPower cycle damage to IGBT modulesFragile areas where typical power electronic devices are prone to defectsThe bonding line falls off and breaksFr

5、agile areas where typical power electronic devices are prone to defectsChip solder layer crackingFragile areas where typical power electronic devices are prone to defectsCracking of substrate welding layerPart II Micreds Solution for Thermal Resistance and Power Cycle Testing of Power DevicesMicReD-

6、Solution for Thermal TestingTransient thermal testing-Origin of structural functionsThermal impedance curve R()Zth)(iR=)(ithiRRthiithiRC/=Time constant spectrumFoster to Cauer model transformationZthK/Wtst1P(t)tT(t)W(t)?Provide constant heating power to the DUT,and then cool it downTransient thermal