高压连接：面向人工智能数据中心的电源与冷却解决方案由TE Con​​nectivity呈现.pdf

1、High-VoltageConnectivity:Power&Coolingfor the AI Data CenterPresented by TE Connectivity2 2025 TE Connectivity.Confidential&Proprietary.Do not reproduce or distribute externally including non-authorized representatives and distributors.Create a sustainable future by limiting print copies and recycli

2、ng paper.AI is driving explosive growth in data center workloads and power demands.Power and cooling are now critical bottlenecks for scalability and sustainability.Next-generation connectivity and architectures are essential for future-ready infrastructure.3Power&Cooling:The New Frontier for AI Dat

3、a CentersStefanie MoserDirector,Power SolutionsDigital Data Networks BUTE ConnectivityPresented by 2025 TE Connectivity.Confidential&Proprietary.Do not reproduce or distribute externally including non-authorized representatives and distributors.Create a sustainable future by limiting print copies an

4、d recycling paper.4HPR v1&v2HPRv3:Side Power RackHPRv4:High Voltage RackPOWER CAPABILITIESUp to 200kW300kW1MWOCP RACK PLATFORMSPWRGPUCPUPWRGPU/CPUPWRGPU/CPU+/-400V OR 800V50V50VSource:OCP EMEA 2025TE is supporting“Whip to Chip”solutions across these rack platformsHigh-Voltage Rack Platforms&Power Tr

5、ends:Architecting for Megawatt Era 2025 TE Connectivity.Confidential&Proprietary.Do not reproduce or distribute externally including non-authorized representatives and distributors.Create a sustainable future by limiting print copies and recycling paper.5ORv3 interface compatibleScalable power optio

6、ns:Multiple configurations:400kW,750kW,1MW(50V)Enhanced efficiency:Up to 5x more current capacity vs.same factor air-cooledAvailability:Sampling now,mass production ready in Q1 2026Liquid-Cooled BusbarHorizontal Rack-to-Rack BusbarHigh current density:Horizontal busbar connecting Power and IT Gear r