CDX在芯片设计领域的创新：从标准化到系统实现.pdf

1、Seungmin Woo,PhD candidate,Georgia Institute of TechnologyDavid Ratchkov,Anemoi Software IncCDX Innovations in Chiplet Design:From Standardization to System RealizationSERVER:OPEN CHIPLETECONOMYCDX Innovations in Chiplet Design:From Standardization to System RealizationSeungmin Woo,PhD candidate,Geo

2、rgia Institute of TechnologyDavid Ratchkov,Anemoi Software IncSERVER:OPEN CHIPLETECONOMYChiplet Design Exchange is a workstream under Open Chiplet EconomyOur charter is to develop chiplet standards and facilitate workflow interoperability of EDA tools and design exchange for chiplet developmentIntro

3、duction to CDXStandardsWorkflows3DK Schema described with OCP CDXML/JEDEC JEP30Develop and describe chiplet integration workflowsPublished:CDK,ADK,MDK,TDKWork in progress:SI/PI DK,PDRM,TDK 2.0Published white paper“Guide to Integration Workflows for Heterogeneous Chiplet Systems”CDX Demo Design3DK:3D

4、-IC Design Kit3DKADKMDKTDKSI/PI DKCDKPDRMAssembly Design KitDescribe package assembly rules Material Design KitDescribe material propertiesTest Design KitDescribe test pins Package Design Rule Manual KitsDescribe package stack up and design rulesChiplet Design KitChiplet description,including physic

5、al,electrical,etc.SI/PI Design KitTarget design and sign-off verification using targets defined in CDXML by IP and chiplet vendorsJEDEC lead standardization effort with OCP and IEC contributing3DK Application in WorkflowsArchitectureChiplet selectionCDK for choosing chipletsADK for chiplet compatibi

6、lityDRM for package technologyPackage planingDRM for choosing a technologyMDK for material propertiesSystem planningADK for physical floorplanCDK for netlist creationPerformance analysisSI/PI Design KitMDK for thermalDesignDFTTDK for test connectivityPackage designDRM for design rulesSign-offSI/PI a