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通过节能互连技术推动人工智能革命.pdf

上传人: 明**** 编号:1012022 2025-12-21 15页 5.70MB

1、 Ciena Corporation 2025.All rights reserved.Proprietary Information.Enabling the AI Revolution Enabling the AI Revolution Through EnergyThrough Energy-Efficient Efficient Interconnect TechnologiesInterconnect TechnologiesBilal RiazSr Director,Product Line Management Ciena Corporation 2025.All rights

2、 reserved.Proprietary Information.Scaling Strategies for AI ClustersAI/ML cluster driving the exponential growth in data center traffic and bandwidthScale-Up:224G-448G per lane SerDes,higher symbol rates,better packaging and connectors,higher shoreline densityScale-Out:224G-448G per lane optical Add

3、 more parallel lanes(8,16,32 lanes per module)Scale-Across:Build large Coherent fabrics with predictable latency and fault-toleranceSource:International Energy Agency Ciena Corporation 2025.All rights reserved.Proprietary Information.Copper or Light?Choosing the Right Highway for AICopper:cheap,low

4、power,short reachLimited with 100Gbps+per lane unless active technology used(e.g.re-timers)Optical:long reach,high bandwidth,higher cost/powerMany different architectural approaches with CPO,NPO,LPO,etc.AI workloads are pushing copper beyond limits.Gradual transition to optical for ultra-high speeds

5、 and reach We have already entered the terabit and petabit era Ongoing evolution of technology in and around the data center,leveraging adjacency Ciena Corporation 2025.All rights reserved.Proprietary Information.Cracking the GPU Beachfront(I/O)BottleneckPCBSubstrate TIA/DRV Electrical ChannelLinear

6、 Pluggable Optics PCBSubstrate Optical module Elec ChannelFiber portPCBSubstrateDSP Electrical ChannelPluggable optical module TIA/DRV PCBSubstrate ChipFiber portPCBSubstrateTx DSP Electrical ChannelPluggable Receive OpticsTIA/DRV Optical module Linear Pluggable(LPO)Power:10w(6.5 pJ/bit)Fully Retime

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根据报告的内容,全文主要内容概括如下: 1. **AI集群扩展策略**:通过提升每通道SerDes速度、增加并行通道数和构建大型互连网络来扩展AI集群。 2. **铜线与光纤选择**:AI工作负载推动铜线技术超越极限,逐渐转向光纤以实现超高速和长距离传输。 3. **GPU I/O瓶颈突破**:通过优化PCB设计、使用线性可插拔光学模块和先进调制技术来提高I/O性能。 4. **448G生态系统**:采用3nm CMOS技术,实现448Gbps传输速率,降低功耗和成本。 5. **超高速带宽挑战与解决方案**:采用3nm DSP、硅光子学和TFLN等材料,以及创新封装技术来应对超高速带宽挑战。 6. **液冷技术**:Ciena致力于开发液冷技术,以支持下一代光学模块和xPO接口,提高散热效率。
"AI集群扩容策略揭秘" "铜线还是光纤?AI时代选择之路" 挑战与解决方案"
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