当前位置:首页 > 报告详情

释放人工智能规模化发展的潜力:UALink与OCP的合作.pdf

上传人: 明**** 编号:1012002 2025-12-21 12页 1.51MB

1、Kurtis Bowman,UALink Consortium Board Chair,AMDUnleashing AI Scale-Up:UALink and OCP CollaborationUnleashing AI Scale-Up:UALink and OCP CollaborationKurtis Bowman,UALink Consortium Board Chair,AMDOCP SPECIAL FOCUS:ARTIFICIAL INTELLIGENCE(AI)Advancing AI Across Data CentersAI models continue to grow,

2、they require more compute and memory to efficiently execute training and inference on large modelsThe industry needs an open solution that enables efficient distribution of models across many accelerators within a podLarge inference models will require scale-up of 10s 100s of accelerators in podsLar

3、ge training models will require scale-up and scale-out from 100s 10,000s of accelerators by connecting multiple podsUltra Accelerator Link TimelineMay 2024Promoter Group Press ReleaseOctober 2024UALinkMembership Forms Posted To WebsiteApril 2025UALink 200G 1.0 Specification PublishedAugust 2025UALin

4、k 200G 1.0 Specification Receives FMS Most Innovative Technology AwardMay 2025UALink Consortium reaches 100 membersSeptember 2025UALink 128G DL-PL 1.0 Specification PublishedUALink Creates the Scale-up PodHigh performanceUp to 800Gbps per Port,scalable ports per accelerator,Up to 1,024 acceleratorsL

5、ow latencyOptimized protocol,transaction,link&physicalLow powerThe simplified UALink stack leads to lower power solutionsLow die areaOptimized data layer and transaction layer saves significant die area UALink delivers optimized scale-upsolutions with single-tier switchingScale-Out NetworkThe UALink

6、 interconnect enables Accelerator-to-Accelerator communicationThe initial focus is sharing memory among acceleratorsDirect load,store,and atomic operations between accelerators(i.e.GPUs)Low latency,high bandwidth fabric for 100s of accelerators in a pod(up to 1K)Simple load/store/atomics semantics w

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
根据标记内容,全文主要内容概括如下: - **UALink™ 发展计划**:预计2024年5月发布,2025年8月发布200G 1.0规范,2025年9月达到100名成员。 - **技术特点**:高带宽(800Gbps/端口),低延迟,低功耗,低芯片面积。 - **应用场景**:支持大规模AI模型训练和推理,适用于数据中心内数百个加速器之间的连接。 - **与OCP合作**:与OCP合作,整合UALink到AI集群,利用OCP在系统架构方面的专长。 - **规格与标准**:200G 1.0规范提供高性能、低延迟、高带宽,支持多目的地请求和响应。 - **预期效益**:提高AI应用效率,降低总拥有成本(TCO),推动AI基础设施发展。
AI加速器新连接时代?" AI数据中心新篇章?" AI规模扩展的利器?"
客服
商务合作
小程序
服务号
折叠