适用于高功率密度人工智能数据中心的巨型AALC.pdf

1、Rajesh Kasukurthy(AMD)Yuzhou Lin(Wiwynn)Mega AALC for High Power Density AI Data CenterMega AALC for High Power Density AI Data CenterRajesh Kasukurthy(AMD)Yuzhou Lin(Wiwynn)Cooling Environments:Liquid CoolingCOOLING ENVOutlineData center trendsCooling technology in data centerMega sidecar in data c

2、enterAALC trends Mega sidecar design guidelineAI rack and data center trendsAI TDP is rising rapidly,exceeding the capacity of existing air-cooling infrastructure.Transition to liquid cooling requires 3 to 6 years for site preparation,approvals,design,and construction.AALC offers liquid cooling solu

3、tion to accelerate AI rack deployment in Existing Data CenterAI Rack and Data Center TrendsRack Thermal Design Power(kW)Year20272030150 kW20241000 kWAI Rack 1000 kW by 2030AI Chip Power TrendsReference:Pioneering AI Cooling:High Power Cold Plates with 200W/cm Heat Flux for Next-Gen AI ASICs,OCP APAC

4、,2025Data center building:https:/ timeline/#How_Avisen_Legals_Energy_Team_Can_HelpHeat FluxYear100 W/cm2200 W/cm2Over 400 W/cm220222026203050 W/cm22018Liquid Cooling SolutionAir Cooling SolutionWith the rapid increase in AI TDP,the existing data center infrastructure cannot meet the cooling requirem

5、ents of AI chips,and additional time will be needed to transition and commercial data centers to liquid cooling.The percentage of Liquid cooling is trending close to be 98%by 2027.with the rack power reaching a MegawattCooling TrendsPercentage of LiquidYear70%85%98%20242025202750%2023Hybrid cooling

6、technology in data centers:Two main approaches in Hybrid Cooling Technology:RDHx and Sidecar,both enhance AI rack cooling without full retrofitRecap 2024 OCP presentation resultSidecar uses less power at the same thermal load(24kW),delivers a more efficient,scalable path for AI rack deployment Hybri