芯片分割：一种用于芯片设计和验证的模块化方法.pdf

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1、Mark Knight,ArmSplitting the Die:A Modular Approach to Chiplet Design and Verificationv3v3Splitting the Die:A Modular Approach to Chiplet Design and VerificationMark Knight,ArmSERVER:SERVER:OPEN CHIPLETOPEN CHIPLETECONOMYECONOMYv3v3Building An Open Chiplet Economy Community Standards Enable independ

2、ent designindependent design of chiplets Accelerate innovation Late bindingLate binding of dies to SoCs Reduce cost and time to market Chiplet test and verification Maintain in-package efficiency and security Software reuseMarketplace Extend designdesign and IPIP reuse Establish buyer confidence and

3、 simplify procurement Maximize buyer choice Product catalogue with increased compatibility Commercial playbooks and contract templates Arms Chiplet System Architecture was announced in February 2024Defines how a monolithic(Arm-based)SoC is partitioned into chiplet componentsFirst public specificatio

4、n released in January 2025,with 70+partners engagedInitial focus Infrastructure and Automotive use casesValue propositionReuse of IP and alignment of system-level designs across Arm based systemsPathway to greater interoperability of chiplets and an open chiplet marketplaceDescribes system and chipl

5、et types,partitioning schemes,and interfacesComplementary to industry standards that focus on multi-vendor plug and play of motherboard components as chipletsArm standard that is openly licensed(AMBA model)has served the initial focus very well.ACSA has compliant implementations including across mul

6、tiple vendors.Arm Chiplet System Architecture(ACSA)Scope of the Arm Chiplet System ArchitectureFunctional partitioningPhysical designSystem designArm CSA ScopeSystem softwareAccelerator functionalityCompute performanceChiplet functionalpartitioningChiplet form factorPhysical interface capacityPackag