当前位置:首页 > 报告详情

联发科发布数据中心计算和ASIC技术创新驱动力报告.pdf

上传人: 明**** 编号:1011971 2025-12-21 12页 1.61MB

1、Copyright MediaTek Inc.All rights reserved.C.K.PengS R.M A R K E T I N G D I R E C T O R,M E D I A T E KDriving Innovation in Data Center Computing and ASIC TechnologiesO C P G l o b a l S u m m i t 2 0 2 5Copyright MediaTek Inc.All rights reserved.2AI Makes Dreams Come TrueFrom Hollywood to real li

2、feO C P 2 0 2 5Nightrider 1982Minority Report2002Tesla FutureJ E N S E N H U A N GPRESIDENT&CEO,NVIDIAR I C K T S A IVice-Chairman&CEO,MediaTekV I N C E H UCorporate Vice President,MediaTek2025Copyright MediaTek Inc.All rights reserved.36.14020232028C U S T O M A I A C C E L E R A T O R T A M ($B N)

3、46%Custom Silicon a Key Enabler of Accelerated ComputingO C P 2 0 2 5MediaTek positioned to be an industry leader in Accelerated ComputeCAGRSource:MediaTek Strategic MarketingCopyright MediaTek Inc.All rights reserved.4Moores Law Cant Keep Up With AI Compute DemandO C P 2 0 2 5VsP H Y S I C A L D E

4、S I G N =X 2 /Y E A RComputing TOPsInterconnect BW GB/sMemory HBM BW GB/sx 2x 2x 2T R A I N I N G C O M P U T E T R E N D =X 1 0/Y E A RCopyright MediaTek Inc.All rights reserved.5MemoryHBM-Custom HBMDigital CIMCompute2nm-A16Advanced Packaging3X Reticle-Large Reticle2.5D-3.5DInterconnect224G-448G Se

5、rDesElectrical to OpticalOEOEOEOEOEOEOEOEOEOEOEOEOEOECompute DieCompute DieCustomHBMCompute DieCompute DieCompute DieCompute DieIO DieIO DieGen1CPOOEOEOEOEOEOEOEOEOECPCCPCCPCCPCCPCCPCCPC400G Serdes400G/Custom SerdesLong reach connectionsLong reach connectionsShort reach connectionsCustomHBMCustomHBM

6、CustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMCustomHBMAddressing Increasing ComplexityO C P 2 0 2 5Copyright MediaTek Inc.All rights reserved.6O C P 2 0 2 5Advanced 3.5D Packaging Brings A Silver LiningPerformance to Total Cost of Operation Ratio Critic

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
根据报告的内容,全文主要内容概括如下: 1. **AI计算需求增长**:摩尔定律无法满足AI计算需求,预计2023-2028年,定制硅ACAC增长率将超过46%。 2. **技术发展趋势**:从2.5D到3.5D封装,从铜到光互连(CPO),以及从HBM到定制HBM的内存技术。 3. **MediaTek战略**:MediaTek定位为加速计算行业领导者,其ASIC解决方案支持AI创新,涵盖工艺、封装、功率和连接性。 4. **技术领先**:MediaTek在SerDes、光学、高速I/O、Die到Die互连和内存方面处于领先地位。 5. **生态系统合作**:与TSMC、NVIDIA、Intel、SK Hynix、Micron、Samsung等合作伙伴建立协同生态系统。 6. **未来展望**:MediaTek致力于推动技术边界,从芯片到集群,为AI ASIC的未来发展提供动力。
AI计算的银弹?" MediaTek如何引领AI加速?" CPO技术如何改变未来?"
客服
商务合作
小程序
服务号
折叠