构建面向未来的AI数据中心需要标准化与创新相结合.pdf

1、Vik MalyalaSVP Technology&AISupermicroData Centers Require Open TechnologiesTamanna SaitVice President Engineering,CloudCrusoeHow Do We Get to This?How Do We Get to This?We are all outgrowing the rackThe Community is KeyInnovation and Challenges in AI Data CenterInnovation and Challenges in AI Data

2、CenterServer Node DensityInterconnectEthernet/IBCPU/GPU/DPUPerformance&TDP StorageLatencies and CapacityEnergyEfficiencyData Center Power Cooling&LocationRack Density&PowerAccelerated ComputingGiga Data CentersOptimized Switching FabricHot/Warm DataPUE/OPEXWill Require Working TogetherManaging Incre

3、ased TDP with Advanced CoolingManaging Increased TDP with Advanced CoolingTraditional Chilled Water Door SystemDirect To Chip(DLC)Heat ExchangesCoolant Distribution Unit(CDU)Coolant Technologies Glycol,Dielectric&Synthetic FluidsLiquids/ImmersionMicrofluidic cooling techniquesChip Packaging and Heat

4、 Transfer TechnologiesAll of this Must Work Together Community Involvement is CriticalAn Entire EcoSystemReaching Out and Collaborating WithReaching Out and Collaborating With The Green Grid DMTF Redfish Open Compute Project OpenBMC Ultra Ethernet AI Infrastructure Coalition Liquid Cooling Coalition

5、 Industry leading OCP validations on the marketplace Volunteering with YOU!Volunteering with YOU!Volunteering-OCP Advisory BoardSpecifications(6)White Papers(4)Products(23)Lets continue to work together in the interest of our Lets continue to work together in the interest of our customers and societ

6、ycustomers and societyImmersion Cooling Immersion Cooling We are grateful for the role that Supermicro has played within the OCP Community,and eager to see what the future holds,Michael Schill,Senior Director of Community,Open Compute Project Foundation.The leadership and industry expertise contribu