推进数据中心移动医疗系统：通过生态系统连续性实现下一代架构和人工智能.pdf

1、Michael Gregoire,Dell TechnologiesAdvancing DC-MHS:Enabling Next-Gen Architecture and AI with Ecosystem ContinuityAdvancing DC-MHS:Enabling Next-Gen Architecture and AI with Ecosystem ContinuityMichael Gregoire,Dell TechnologiesServer:Modular Hardware SystemMHS Spec Collection3Host Processor ModuleD

2、C-SCM(mgmt.)M-CRPS(power)peripheral subsystemsperipheral subsystemsM-FLW Full-Width HPMM-DNO Density Optimized HPMM-SDNO Scalable HPMsM-XIO and PESTI for peripheral connectivityM-PIC Platform Infrastructure ConnectivityM-PNP Plug-and-Play48V Support2022/20232024/2025CFF DC-SCMHFF DC-SCM*EDGE-MHS not

3、 DepictedEDGE-MHS HPM Form FactorsHPMsVFF DC-SCMSCMsSDNO 1.1 Summary and TimelineM-SDNO6/2024R1 v1.0R1 v1.15/20251.Added new HPM“Class E”enabling direct connection of M-CRPS PSUs with M-SDNO in 19”solutions2.Added support for 48V power Ingress and Egress3.Added option of using Compact Form Factor(CF

4、F)DC-SCM instead of Horizontal Form Factor(HFF)DC-SCM10/2024Global Summit 202410/2025Global Summit 2025M-FLW/M-DNO4/2024M-DNO v1.1M-FLW V1.210/2024Global Summit 202410/2025Global Summit 2025No Updates This YearReminder:M-SDNO 2024 Overview5 M-SDNO SpecificationDoes not use Types(as FLW and DNO did)D

5、efines HPM Class A,B,C,DAll HPM Classes have:Consistent width and feature setAllow for variable lengthDefines Minimum and maximum lengthsDefines Common Chassis Intervals(CCI)HPM DesignersDesign to the smallest HPM length/width that can fit a given solution/feature setSystem DesignersAllocate given l

6、ength/width within chassis to HPM,can support any HPM=to those constraints(like PCI CEM)Class E LayoutEnabling direct dock of M-CRPS in M-SDNO 19”HPMClass E Common Chassis“Drop in”compatible with Class A,B,E(Not:C)M-SDNO Chassis Compatibility OptionsDC-MHS for AI from GS 2024Key differences highligh