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利用 1.6T 网络大规模驱动 AI:开放式 100T 交换机将如何重新定义 2026 年及以后的数据中心(Celestica 出品).pdf

上传人: 明**** 编号:1011756 2025-12-21 17页 3.42MB

1、2025 OCP Global Summit Executive Session|October 2025|CelesticaTareq Bustami,VP Market Technology,CelesticaHasan Siraj,Head of Software Products,BroadcomDriving AI at Scale with 1.6T Networking2025 OCP GLOBAL SUMMIT2025 OCP Global Summit Executive Session|October 2025|Celestica2Driving AI at Scale w

2、ith 1.6T Networking:How Open 100T Switches will Redefine Data Centers in 2026 and BeyondWELCOME TO THE CELESTICA AND BROADCOM PRESENTATIONHasan SirajHead of Software Products and EcosystemTareq BustamiVP Market Technology2025 OCP Global Summit Executive Session|October 2025|Celestica1 MillionA I A C

3、 C E L E R A T O R SNew AI Models 100X+Scale Distributed Computing2025 OCP Global Summit Executive Session|October 2025|CelesticaA Very,Very Large Distributed Computing SystemXPU ClusterXPU Network for AI workloadsCPUOptimized for Serial TaskGPUOptimized for Parallel TaskTENS OF THOUSANDS CORESMULTI

4、PLE CORESTHOUSANDS CORES2025 OCP Global Summit Executive Session|October 2025|CelesticaThe NetworkIs the Computer2025 OCP Global Summit Executive Session|October 2025|CelesticaAI Fabrics:The Nervous System of AI Infrastructure6SCALE-OUTSCALE-UPAcross Data CentersIn RackAcross RacksAcross RacksSpineL

5、eafSpineLeafData Center 02Data Center 012025 OCP Global Summit Executive Session|October 2025|CelesticaKey Challenges in Deploying Large Scale AI Clusters7Release Cadence2 YEARS1 YEARSerDes SpeedsCoolingOptics100G200GAIRLIQUID800G1.6T2025 OCP Global Summit Executive Session|October 2025|CelesticaOpe

6、n Standards2025 OCP Global Summit Executive Session|October 2025|CelesticaEthernet Scale-up:9High Performance,Open,Existing SpecificationsExecute at your own paceFreedom to innovate/implementPush vs Pull memory accessOrdering modelLoad BalancingSchedulingEthernet for Scale-up Networking(ESUN)Focus A

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根据《Data》标记内容,全文主要围绕大规模AI集群的部署和未来数据中心的发展展开。以下是关键点: 1. **AI集群规模**:1百万AI加速器,支持100X+规模分布式计算。 2. **网络架构**:采用Spine-Leaf架构,支持跨数据中心扩展。 3. **技术挑战**:包括发布周期、SerDes速度、冷却和光学技术。 4. **开放标准**:采用开放标准,如Ethernet Scale-up Networking (ESUN)。 5. **性能提升**:Tomahawk 6与Thor Ultra网络接口卡,实现128K GPU两层级扩展,降低40%以上功耗和延迟。 6. **Celestica DS6000 & DS6001**:基于Tomahawk 6,提供102.4Tbps容量和224G SerDes端口。 7. **开放集群设计**:OCP的AI集群设计项目,提供最佳实践蓝图。 8. **AI网络TPU**:支持多种AI加速器,如AI4Trainium、Inferentia、MTIA等。
揭秘1.6T网络" AI集群部署挑战解析" AI网络未来趋势展望"
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