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利用 P4 DPU 加速 AI:AMD AI 网卡实现更高层次的灵活性、性能和扩展性.pdf

上传人: 明**** 编号:1011718 2025-12-21 15页 1.25MB

1、Accelerated AI with P4 DPUs Next-Level Flexibility,Performance&Scale on AMD AI NIC2|High Performance AI NetworkingSolving the Most Critical Challenges for Scaling AI and HPCHigh Performance AI NetworkingSolving the Most Critical Challenges for Scaling AI and HPCOpen ProgrammablePerformant3|Large-sca

2、le AI Requires Next-Gen NetworkingIntelligent End PointsScale-Out Message semantic Higher scale with multi-tier fabric Load balancing Resilience in transport layer to recover from occasional packet loss Scale-Across Address the power constraint Higher latency Non-uniform bandwidth Intelligent conges

3、tion control and load balancingSite-1Site-2Scale-Up High bandwidth(10 x of scale-out)Low latency Unified memory space Load/Store semantic Extremely sensitive to failure and packet loss4|Open Interoperable Solutions for AMD Instinct AI NetworkingPollara 400 AI NIC Product OptionsRoCEv2,UEC-Ready RDMA

4、&Custom TransportLeadership Performance;P4 ProgrammableAMD InstinctMI3XX GPUPollara400-1Q400P(PCIe Gen5)Pollara400-1Q400P-OCP(OCP 3.0)New Product LaunchPollara 400:Ethernet Designed for the Era of AI 5|Driving Industry Momentum Through Strategic PartnershipsCOMPUTENETWORK6|AMD Pensando Pollara 400 A

5、I NICSingle Platform for Front-End and Back-End NetworkingAMD Pensando Pollara 400 AI NICSingle Platform for Front-End and Back-End NetworkingUnlocking Unprecedented Performance&Scalability for AIPerformance LeadershipPerformance Leadership10%Over Competition10%Over CompetitionMassive Cluster ScaleM

6、assive Cluster Scale20X20XLowerNetwork CostLowerNetwork Cost50%50%Over InfiniBandWith Multi-Plane7|Up to 10%better RoCEv2 PerformanceUp to 10%better RoCEv2 PerformancePollaraUp to1.1xPollara 4008%Reduced Job Completion Time(TFLOPS/s/GPU)8%Reduced Job Completion Time(TFLOPS/s/GPU)Key Features&Benefit

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根据报告的内容,全文主要内容概括如下: - **高性能AI网络解决方案**:针对AI和HPC的扩展挑战,提供高性能AI网络解决方案。 - **Pollara 400 AI NIC**:AMD推出的Pollara 400 AI网卡,支持RoCEv2、UEC-Ready RDMA和自定义传输,提供卓越性能。 - **性能提升**:相比竞争对手,Pollara 400在性能上提升10%,网络成本降低50%,作业完成时间减少8%。 - **UEC RDMA优势**:UEC RDMA比RoCEv2性能提升25%,模型收敛速度提高50%。 - **多平面架构**:Pollara 400采用多平面架构,降低成本并提高GPU利用率。 - **AMD “Helios” AI Rack**:优化AI机架解决方案,支持72个GPU和18个扩展开关托盘。 - **“Vulcano”下一代NIC**:即将推出的800G网络吞吐量,支持软件前向和后向兼容。 关键点: - 性能提升10%,网络成本降低50%,作业完成时间减少8%。 - UEC RDMA性能提升25%,模型收敛速度提高50%。 - 多平面架构降低成本,提高GPU利用率。 - AMD “Helios” AI Rack优化AI机架解决方案。 - “Vulcano”下一代NIC支持800G网络吞吐量。
"P4 DPU加速AI,性能翻倍?" "AMD AI网卡,AI网络新高度?" "大规模AI,网络挑战如何破?"
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