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下一代 ORv3 HPR 功率等级和采用液冷母线的边车架构.pdf

上传人: 明**** 编号:1011672 2025-12-21 22页 2.13MB

1、Hal LoketDmitriy ShapiroNext Gen ORv3 HPR Power Levels and Sidecar Architectures with Liquid Cooled BusbarsNext Gen ORv3 HPR Power Levels and Sidecar Architectures with Liquid Cooled BusbarsHal Loket,System Architect,TE ConnectivityDmitriy Shapiro,Mechanical Engineer,MetaRACK&POWERBackground&Industr

2、y Power TrendsLiquid Cooled Busbar Design&Test UpdatesNext Generation Liquid Cooled BusbarsSide Power Rack Architecture&Horizontal Busbars(Disaggregated Power)Pushing Horizontal Busbar BoundariesCall To ActionAgendaPOWERWorkloads are exceeding air cooling limits for standard ORv3 HPR rack systemsLiq

3、uid cooled busbar increases current carrying capacity in same footprint by 5x by cooling both busbar and connectorsBackground&Industry Power TrendsAI demand continues to push power and space constraintsSPACEAI gear is taking up more and more room within the rack48V(HPRv3)and HVDC(HPRv4)side power ra

4、ck architectures are under development to move power systems outside of IT rackLiquid cooling has potential to reduce number of connectors and copper needed for power rack-IT Gear rack connectionBackground&Industry Power TrendsAI demand continues to push power and space constraints*Note:The TE produ

5、cts shown in this presentation are shown for reference only and are not currently licensed Contributions to any OCP specification.5x current carrying capacity increaseSame form factor&mounting as ORv3 HPR1.2MW+in workSidecar explorationLiquid Cooled vs Air Cooled BusbarReference:2024 OCP Global Summ

6、it Liquid Cooled Busbar PresentationAdded features for integration with:HPRv3 horizontal busbarsHPRv2 72kW shelvesSupports bolted and floating busbar connectors(e.g.,BB2000/4000 series)Coolant interface:UQD04 for quick connection and hose length variationCold plate long term reliability ongoingOCP v

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根据标记内容,全文主要围绕下一代ORv3 HPR电力系统及其液冷母线技术展开。以下是关键点: 1. **背景与行业趋势**:AI需求推动功率和空间限制,液冷母线技术提高电流承载能力。 2. **液冷母线设计**:液冷母线设计支持HPRv3和HPRv2,支持多种连接器,并正在开发1.2MW的母线。 3. **下一代液冷母线**:支持更大功率的连接,更宽的冷板,并计划于2026年第一季度推出OCP液冷母线设计规范。 4. **侧电源机架架构**:侧电源机架通过水平母线连接,支持500A电流。 5. **水平母线设计**:考虑接触电阻、可靠性、可维护性和安全性,进行热测试,以优化电流分配。 6. **推动水平母线边界**:通过风扇和液冷提高电流承载能力,目标是减少系统阻抗。
"液冷母线提升电流承载,揭秘!" "下一代AI系统,液冷母线如何助力?" "侧置电源架构,液冷技术革新解析!"
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