专题讨论：EDSFF 最新动态及即将推出的更新.pdf

1、Peter Choi,Pure StorageRoss Stenfort,MetaArthur Lai,MolexAnthony Constantine,MicronPanel:EDSFF New and Upcoming UpdatesE2 High Capacity SSD Form FactorPeter Choi,Pure StorageSTORAGEShare our experience in designing and shipping high capacity QLC drives and contribute to a new industry standard-E2Des

2、igned to support:64 NAND packages“oversized BGA178”large flash controllerhigh DRAM placementSingle circuit board30W+with low airflowHigh capacity form factorPure Storages 300TB DirectFlash Module in U.2 LongU.2 Long E2U.2 Long to E2E2-boardE2:Next Generation QLC Form FactorRoss Stenfort,MetaSTORAGEI

3、ncreases Storage Chassis DensityIncreases Device TB/WImproves Performance/TB ScalingEnables Power Based Performance ScalingQLC Overview/ChallengesDRAMTLC SSDQLC SSDHDDQLC Creates Storage Tier Between TLC SSD and HDDOverview:2024 Challenge:What form factor is best for High Capacity?Considerations:Max

4、 Capacity Requirement Number of NAND package placements?NAND Packaging-Standard or custom packages-4 Tb die timelines-16 or 32 dies per packageGoal Industry Unified Form Factor for 128 TB and aboveConcern Fragmentation is bad for industry2024 Call To Action:Industry discussion needed to avoid fragme

5、ntation High Capacity Form Factor Industry Collaboration Result:E2E2 enables efficient high-capacity flash storage:Leverages EDSFF including the learnings and best attributes from E1 and E3OverviewOverviewNand Placements x4 PCI Gen 6 and beyond 80W EDSFF Connector Scaling Single PCB Thermally optimi

6、zed enclosureResource EfficientIndustry Standard SFF-TA-1042 V1.0 64+EnablesEnablesDevice Capacity Scaling 40 DevicesDense Chassis Cooling with low airflow above 25WThermalPerformance Scales with power 1 PB and beyondServiceability Form Factor Summary E1.S High Density Compute Storage Market Growth