OCP NIC 2025：现在与未来.pdf

1、Thomas Ng Platform Architect,Editor Intel CorporationJason Rock Distinguished Member of Technical Staff Dell TechnologiesJoe Hanson Vzquez Thermal Mechanical Engineer Intel CorporationSatyam Saini Thermal Engineer MetaOCP NIC 2025:Now and BeyondOCP NIC 2025:Now and BeyondThomas Ng Platform Architect

2、,Editor Intel CorporationJason Rock Distinguished Member of Technical Staff Dell TechnologiesJoe Hanson Vzquez Thermal Mechanical Engineer Intel CorporationSatyam Saini Thermal Engineer MetaSERVER:AI HW SW CO-DESIGN/NIC/HPCHistoryElectrical updatesPCIe and thermal testingThermal challenges for 1.6TA

3、gendaExample OCP NIC CardsIntel Ethernet Network Adapter E810-CQDA2 for OCP 3.0Intel Ethernet Network Adapter E830-XXVDA8F for OCP 3.0(DSFF)Broadcom BCM957504-N425G Ethernet OCP 3.0 SFF Network AdapterNVIDIA Mellanox ConnectX-6 Lx Dual Port 10/25GbE SFP28 OCP 3.0OCP NIC 3.0 version 1.5.0 released Q3

4、-2024Introduced DSFF&Timing(Flex I/O)Version 1.6.0 released&accepted Q1-2025 OEM MultiRecord Type ID allocationsEnables M-PnP that was announced at GS2024Resolves conflicts with DC-SCM(0 xC1),M-CRPS(0 xC2)Clarified Flex I/O termination&USB isolationClarified power state tableElectrical Updateshttps:

5、/www.opencompute.org/contributions?contributions%5Bquery%5D=ocp%20nic%203.0OCP NIC 3.0 suppliers shall follow PCIe routing specificationsSection 5.3.2 defines test fixtures used for compliance testingCompliance Load Board(CLB)test systems with OCP NIC 3.0 slotsCompliance Base Board(CBB)test OCP NIC

6、3.0 mezzanine cardsOCP NIC 3.0 CLB&CBB test fixtures designed to:Emulate PCIe CEM CLB&CBB fixturesLeverage PCIe test equipment automation without significant modificationThe OCP-NIC sub-group recently chartered an SI workstream to contribute Gen 7 conformance/informative limits in adherence to the t