MHS：模块化即插即用 (M-PNP) 工作流程更新和关键主题深度解析.pdf

1、Jeff Kennedy,Engineering Technologist,Dell TechnologiesPhillip Leech,Principal Technologist/Architect&M-PNP Chair,HPE Todd Rosedahl,Director Systems and AI strategy,JabilMHS Modular Plug-and-Play Workstream OverviewMHS Modular Plug-and-Play Workstream OverviewJeff Kennedy,Engineering Technologist,De

2、ll TechnologiesPhillip Leech,Principal Technologist/Architect&M-PNP Chair,HPE Todd Rosedahl,Director Systems and AI strategy,JabilSERVER:MODULAR HARDWARE SYSTEM(MHS)Introduction Overview of Problems/Ecosystem Challenges Vision,Progress and RoadmapFRU,Discovery,and Boot SpecificationFPGA Specificatio

3、nSchedule&Call to ActionAgendaOverview What and WhyROTBMCBIOSLTPISCMCPLDWhat:Mix/Match DC-SCMs,HPMs,Peripherals in an MHS inspired ChassisDifferent Vendors,CPU architectures,and technology generationsProvide full function solutions with seamless integration without co-designCommoditize non-value-add

4、ed platform enablementWhy:Ecosystem enablementSystems management infrastructure integrationTTM for diverse host domain silicon:Intel,AMD,ARM,PowerPC,etc.Lower OpEx and CapEx to integrate and validate Generational re-use of HW with cost&sustainability benefitsEnable new CPU,Memory&IO technologies mor

5、e easilyEnable customer specific value-add and security solutionsDifferent:Host Silicon:Intel,AMD,ARM,PowerPC,RISC-V,GPUs,Memory TypesSensors:Temperature,Power,etc.Peripherals:Device classes&typesBus topologies:Behind Muxes perhapsICs:Approved Vendor List.Thermal requirements:Fan control,Throttle,Sh

6、utdownChallenge:HPM(and beyond)Discovery&ManagementStandardizationEvery HPM has X sensor at Y location to be used for Z purposeDoable for some things,but not practical for allNew BMC FW developed and loaded for each HPMBMC identifies the HPM and loads the correct images(BIOS,FPGAs)Requires co-design