当前位置:首页 > 报告详情

200G 扩展网络中的铜互连.pdf

上传人: 明**** 编号:1011579 2025-12-21 17页 2.03MB

1、Raymond LawCopper Interconnects in 200G Scale-Up NetworksCopper Interconnects in 200G Scale-Up NetworksRaymond LawLOTESCompany:LOTES is a precision electronic interconnect components and hardware supplier since 1986.Based in Taiwan,LOTES designs and manufactures a wide range of components including

2、state-of-the-art high-speed cable/connector,cooling,and power connectors.LOTES is an active participant in many industry workgroups including PCI-Sig,JEDEC,HDMI Forum,USB-IF,VESA,SNIA,and OCP.Visit us at booth C9.Presenter:Raymond Law()is an electrical engineer focuses on high-speed signal integrity

3、.With over 20 years of industry experience,Raymond is a R&D Project Manager and represents LOTES in various industry workgroups.IntroductionScale-Up NetworkInterconnect Length RequirementsBackplane TopologiesConnector and cableCo-Package Copper(CPC)and Near-Package Copper(NPC)RepeatersFront-Panel Pl

4、uggable TopologiesActive CableCopper/Optical Interconnect Transition PointsOther High-Speed Interconnect NeedsCall to ActionAgendaHigh bandwidth,low latency,XPU-to-XPU connectionXPUs+memories become one unified poolWithin a node,but distance is likely 1mIEEE 802.3dj 212.5Gb/s PAM4Scale-Up NetworkUAL

5、ink_200 Rev1.0 specificationScale-Up Network Length RequirementsWithin rack,1 hop,XPU switch XPURack to rack,2 hops,XPU switch switch XPUIf the cables do not need to go through rail/track,estimateWithin rack:1m to 2mAdjacent rack:1.5m to 2mFour racks:7m(4 x 1.75m)Reference:OCP PCIe Extended Connecti

6、vity Requirements WhitepaperXPU+board trace+BP connector/cable/connector+board trace+switch ASICIEEE 802.3dj has roughly 28dB pin-to-pin loss budget at 53.125GHzWith a standard 1m cable,board route would be short,roughly 4”max on each board,depending on board material.Backplane TopologiesSource:Nvid

word格式文档无特别注明外均可编辑修改,预览文件经过压缩,下载原文更清晰!
三个皮匠报告文库所有资源均是客户上传分享,仅供网友学习交流,未经上传用户书面授权,请勿作商用。
根据报告的内容,全文主要围绕200G规模网络中的铜互连技术展开。以下是关键点: 1. **网络规模扩展**:探讨在200G网络中,如何通过铜互连实现高带宽、低延迟的XPU到XPU连接。 2. **长度需求**:在机架内,互连长度可达1m至2m;相邻机架可达1.5m至2m;四机架可达7m。 3. **背板拓扑**:介绍不同背板拓扑,如Twinax电缆和背板连接器。 4. **Co-Package Copper (CPC)和Near-Package Copper (NPC)**:这些技术可以减少插入损耗,延长背板电缆长度。 5. **中继器**:使用中继器(如线性重驱动器和重定时器)可以显著增加总通道长度。 6. **面板可插拔拓扑**:讨论面板可插拔拓扑,包括使用CPC/NPC和主动电缆。 7. **铜/光互连转换点**:在达到一定长度后,可能需要使用光互连。 8. **其他高速互连需求**:包括224G卡边电缆连接器和MCIO Gen7等。 9. **铜互连的优势**:铜互连比光互连更可靠、功耗更低、成本更有效。
"200G网络升级,铜互连如何应对?" "铜线在200G网络中的关键角色揭秘!" 200G网络升级的秘密武器!"
客服
商务合作
小程序
服务号
折叠