下一代微电子增材制造 （XTPL SA）.pdf

1、Additive Manufacturing for Next-Generation Microelectronics Witold Nawrot,PhD|Portfolio Managerrapid.tech 3D,May 14th,2025,Erfurt,GermanyAgenda21.Technology and productsa.Delta Printing Systemb.Modular Printheadsc.High Performance Materials2.Groundbreaking applicationsa.Microbump dispensingb.Ultrapr

2、ecise interconnectionsc.Edge interconnectionsd.Multilayer printinge.Open defect repairf.Redistribution layersg.Transparent electrodes3.Summary4.Q&AXTPL Technology&products013Game changer:Ultra-Precise Dispensing 4UPD technology sets a new standard in terms of resolution,viscosity and size of conduct

3、ive structuresDispensing down to 1 m feature size High resolution Material viscosity range 101 000 000 cPNo overspray=no short circuitNo electric field requiredComplex and various substrates:polyimides,glass,flexible foil,silicon wafers etc.0.5 m1 m10 m50 mUltra-high resolutionHigh resolutionMedium

4、resolutionUnprecedented range of feature sizes XTPL products|Printing Systems5Delta Printing SystemA proven one-stop-shop in R&D and commercial settings Stand-alone,open platform Prototyping and small-volume/nest production Freedom of control over printhead Flexibility of User Interface:manual mode,

5、CAD import,advanced scripting Fast and easy changeover of nozzles and cartridgeXTPL products|Printing Systems6CoreCore+ProModular solutions tailored to customer needsDispensing engine for industrial integrationSeamless integration with manufacturing processes via an APISuitable for continuous/flow l

6、ine productionSmall to high-volume productionSustainable technology no material wasteEasy changeover of cartridge and nozzlesXTPL products|Materials7InkjetAerosol jetLIFTMicrodispensingXTPL UPD3rd party materials:EpoxiesDielectricsConductive adhesivesSolder pastesQuantum DotsTechnology demo|Microbum