13.30 Stefano Sciole - TCLAD.pdf

1、Thermal Management SolutionsNew Gen IMS Materials for Power Electronics Stuttgart,GermanyDec 3-5,2024Ing.Stefano Sciol(BDM TCLAD)TCLAD Technologies a Global CompanyTCLAD is Born from Bergquist and PolytronicsTurnover$50MBusiness UnitsTCLAD Technologies Taiwan,TCLAD In USA,TCLAD Europe GmbHManufactur

2、ing Locations:Prescott WI USA,Hsinchu Science Park Taiwan,Kunshan ChinaDistribution Locations:Prescott WI USA,Kirchheimbolanden Germany,Hsinchu Taiwan,Kunshan China,Hong KongIMS(Insulated Metal Substate)MCPCB(Metal Clad PCB)TIM(Thermal Interface Material)ICE(Immersion Cooling Fluid)SMTB(Surface Moun

3、t Thermal Bridge)OCP(Over Current Protection)Product PortfolioIMS Structure 1 and 2 layersStakeholder NamI.M.S.Product HighlightOur Most Popular IMS MaterialsStakeholder NamHigh Thermal PerformanceHigh Electrical PerformanceLong Term ReliabilitySFL-3was TCB-3 SFL-8 was TCB-8SFL-12 was TCB-C2.2 W/m-K

4、3.0 W/m-K1.7 W/m-K2.75 W/m-KSPL-153.2 W/m-K10 W/m-KHTHPLI.M.S.Product HighlightPower Electronics ChallengesStakeholder NamTHERMAL HIGH POWER MANAGEMENT(thousands Watt)POWER DENSITY MANAGEMENT(W/cm2)3D HEAT SPREADING FEATURE,NO HOT SPOTS FAST REACTION TO HEAT PEAKS STABLE THERMAL PARAMETERS vs AGINGE

5、LECTRICAL HIGH OPERATING AND TEST VOLTAGE TWO OR MORE LAYERSHIGH CURRENT CARRYING FEATURESTABLE ELECTRICAL PARAMETERS vs AGINGSTABLE ELECTRICAL PARAMETERS vs TEMPERATUREMECHANICAL FLEXIBLE FORM FACTORS FLATNESS&WARPAGE CONTROLMECHANICAL STABILITYSOLDER JOINT RELIABILITYI.M.S.Product HighlightLO COST

6、/HIGH YIELDI.M.S.Power ApplicationsStakeholder NamI.M.S.Product HighlightLO COST/HIGH YIELDRelease film or Copper FoilNew Gen IMS Dielectric:SPL-15Stakeholder NamHigher Thermal ConductivityHigh Tg(200C operating)Improved ReliabilityGreater Design Flexibility c