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11.30 Daniel Cederkrantz - Thermtest.pdf

上传人: sec****ies 编号:734600 2025-07-26 3页 1.30MB

1、Daniel Cederkrantz,PhDExperienceSolving Thermal Challenges in Next-Generation 3D Stacked Semiconductor DevicesHosted by CEO,Thermtest Europe PhD in Materials Science 15+years in thermal conductivity 7+years of empowering the electronics industry in selecting the ideal testing methods for their appli

2、cationsTTwo decades of providing intelligent thermal conductivity solutions in the electronics industry.Range of thermal conductivity testing methodsEmpowering you withknowledge to choosethe best testing methodsMethods enabled byproprietary and patentedtechnologiesIntelligent Thermal Conductivity Solutions for Next-Generation 3D Stacked Semiconductor DevicesDetermine thermophysical properties of free standing thin-films.Patented Thermal Resistance Thin-Film ModuleThermal conductivity&thermal resistivityThermal conductivityThin-Film ModuleTAvailable on Advanced MP-1Available on Versatile MP-V

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