AI在测试领域：突破挑战探索新方法.pdf

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1、Executive ConferenceArtificialArtificialIntelligenceIntelligenceexplore the power of AI to transform semiconductor design&manufacturingMarc JacobsMarc JacobsFabless SolutionsAI for TestAI for TestChallenges&ApproachesChallenges&ApproachesThis presentation and discussions resulting from it may includ

2、e future product features or fixes,or the expected timing of future releases.This information is intended only to highlight areas of possible future development and current prioritizations.Nothing in this presentation or the discussions stemming from it are a commitment to any future release,new pro

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4、ioritizations and intended future features or fixes,contact .PDF Solutions,Exensio,CV,Cimetrix,the PDF Solutions logo,and the Cimetrix logo are registered trademarks of PDF Solutions,Inc.or its subsidiaries.All other trademarks cited in this document are the property of their respective owners.Exens

5、io visualizations Powered by TIBCO.2024 PDF Solutions,Inc.or its subsidiaries.All rights reserved.Challenges&Challenges&ApproachesApproachesCopyright PDF Solutions 2024Market:System Quality,Cost,DifferentiationMarket:System Quality,Cost,DifferentiationAdaptive TestingAdaptive TestingChiplet Matching

6、/Characterized KGD(cKGD)*/System BinningChiplet Matching/Characterized KGD(cKGD)*/System BinningPredictive BurnPredictive Burn-in/Binning/Systemin/Binning/System-level Testlevel TestSystemSystemWaferWaferChipletChiplet*Source:*Source:Intel,ERI Summit 2023Copyright PDF Solutions 2024InfrastructureInf