用于XPU到XPU连接的4 Tbit每秒光计算互连小芯片.pdf

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1、4 Tb/s Optical Compute Interconnect Chiplet for XPU-to-XPU Connectivity2024 Hot Chips Saeed Fathololoumi,Intel CorporationAugust 20242Integrated Photonics Solutions2024 Hot Chips Evolution of Optical CommunicationsTelecom Age Long Reach Low Loss optical fiber(100s km)Fiber amplifier(C-band)Discrete

2、optical sub-assemblies Heavy reliance on DSPDatacom Age Low Power 30 pJ/bit Shorter Reach(1Tbps/mm shoreline 5 pJ/bit Rack-level reach(100ns10nsFECKPNone or light-FECOptical interface standardWavelength gridModulation speed and formatMSA20nm O-band FR100&200Gb/s PAM4None yetMSA emerging:100s GHz16-6

3、4Gb/s NRZ is popularHost interface standardIEEE/OIFUCIe/PCI-SIG6Integrated Photonics Solutions2024 Hot Chips Size Integration Yield Voltage Loss Components BER Loss Noise Data rate Multiplexing IntegrationIntegration Size 3D packaging 3.5pj/bit 80%reduction1.5Tbps/mm2Tbps per fiberIn addition to pow

4、er and cost,solution needs to address total BW,BW density and latencyOCI Scaling Vectors and KPIs Points7Integrated Photonics Solutions2024 Hot Chips Integrated Optics:Our Approach Greater photonic functionality integrated on the Photonic Integrated circuits(PICs)best done in silicon photonics Integ

5、ration of PICs with best of breed ICs using Advanced Packaging to create Optical Engines heterogenous integration trumps monolithic integration Tighter Integration of Optical engines with the host(xPU,Switch)enabling new systems and applicationsAn Intel OCI chiplet is a die-stack that provides optic

6、al I/O using Intel Silicon Photonics technology and can be co-packaged with the XPU.We refer to this approach as Co-Packaged Optics(CPO)when applied to networking applications and Optical Compute Interconnect(OCI)when applied to compute fabrics8Integrated Photonics Solutions2024 Hot Chips 8High-Spee