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利用UCIe实现OpenChiplet生态系统.pdf

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1、1|2024 SNIA.All Rights Reserved.Enabling an Open Chiplet Ecosystem with UCIeRichelle Ahlvers,Intel,Vice-Chair and Executive Committee,SNIABrian Rea,Intel,Marketing Working Group Co-Chair,UCI Express2|2024 SNIA.All Rights Reserved.About the PresentersRichelle is a Storage Technology Enablement Archit

2、ect at Intel,where she promotes and drives enablement of new technologies and standards strategies.Richelle has spent over 25 years in Enterprise R&D teams in a variety of technical roles,leading the architecture,design and development of storage array software,storage management software user exper

3、ience projects including mobility,developing new storage industry categories including SAN management,storage grid and cloud,and storage technology portfolio solutions.Richelle has been engaged with industry standards initiatives for many years and is actively engaged with many groups supporting man

4、ageability including SNIA,DMTF,NVMe,OFA and UCIe.She is Vice-Chair of the SNIA Board of Directors,Chair of the Storage Management Initiative,leads the SSM Technical Work Group developing the Swordfish Scalable Storage Management API,and has also served as the SNIA Technical Council Chair and been en

5、gaged across a breadth of technologies ranging from storage management,to solid state storage,to cloud,to green storage.She also serves on the DMTF Board of Directors as the VP of Finance and Treasurer and Chairs the Timberland SIG driving the NVMe-oF reference implementation.Richelle AhlversStorage

6、 Technology Enablement Architect,Intel3|2024 SNIA.All Rights Reserved.About the PresentersBrian Rea is a senior technologist in the industry initiative and technology enabling team at Intel and is the Marketing Working Group Co-Chair for the UCIe Consortium.Brian has held engineering,marketing,and s

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本文主要介绍了UCIe consortium的成立以及其带来的OpenChiplet生态系统。UCIe是一个为芯片间通信定义的小型I/O芯片标准,旨在解决芯片制造和系统设计的挑战。它允许制造超越光刻极限的系统芯片(SoC),提高小芯片的产量,并优化成本和功能。此外,UCIe支持不同的节点上分散的芯片,并使用新的工艺节点实现先进功能。其优势包括加快上市时间,重用经过验证的芯片块,以及创建自定义组合。 文章中提到的关键数据包括:成立于2022年3月,目前拥有超过130个成员,包括IP提供商、工具、芯片设计、晶圆代工、OSAT、服务和终端客户公司。UCIe 1.1版本采用分层方法,具有行业领先的关键性能指标(KPIs),包括物理层、协议层和形式因子。物理层提供芯片间的I/O,协议层支持CXL/PCIe和流式协议,而形式因子层关注plug-and-play IPs和合规性。 对于存储供应商,使用基于chiplets的系统可以让他们聚焦于真正的差异化领域,通过集成已验证的外部组件来加速采用和整合,并使用基于标准的组件(如PCIe和CXL)来构建和集成系统。这有助于加快上市时间,促进技术创新,并利用开放标准定义的最佳类元素。
如何融合创新?" UCIe能为我的企业带来什么优势?" UCIe如何引领行业变革?"
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