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448G连接器和PCB布线研究.pdf

上传人: 明**** 编号:1011310 2025-12-21 49页 3.91MB

1、Page 1April 30,2025YAMAICHI ELECTRONICS CO.,LTD.Toshiyasu ItoConnector and PCB Routing Study for 448GInsertion loss and Routing Length of VLC(Vertical Line Card)Page 2Abstract:-Basically I will explain of the connector and high speed routing of PCB by Vertical Line Card(VLC)structure for 448G.-VLC i

2、s a structure that uses a vertical line card.See after page 4.-The OSFP connector and cage are mounted vertically on the front side of the board,and the ASIC package is mounted on the back side or other Vertical PCB.This brings the connector and ASIC-package closer together,allowing for a shorter di

3、stance for high-speed signal wiring.-We mainly studied the possibility of 448G by High speed routing of PCB by VLC.Supporters:-Chris Cole,Coherent Corp.-Peter Winzer,Nubis Communications-Toshiaki Sakai,SocionextPage 3What is Vertical Line Card(VLC)StructuresPage 42 x FAN(80mm)4x8x4 Cage(Total 128 po

4、rt)Tubes for LiquidLiquid Pump UnitVLC Cage PCB2x PSUCold Plate Liquid Inlet and Outlet to Cold PlateVLC ASIC PCBSwitch Over View of VLC-OSFP(RHS)Cage and Connector Structure:128 ports 4 RU ReferencePage 54x8x4 Cage(Total 128 port)VLC Cage PCBCold Plate Liquid Inlet and Outlet to Cold PlateVLC ASIC

5、PCBExploded View2 x ASICPage 6Study of ModulesPage 7Standard Module:OSFP-RHS:8 lanes(16 Differential Pairs/DP)Standard Module:OSFP-XD-RHS:16 lanes(32 DP)Reference:OSFP Module_Specification_Rev5Reference:Specification for OSFP-XD Rev 1.07Page 8Idea of High Density Module:32 lanes(64 DP)32 lanes by 28

6、0 pins(8x36)And 2D connector size-PWR=12 pins,Control=4 pinsRefer:oif2024.610.05-High Density Connector Project Start Proposaloif2025.010.02-High Density Connector-Sizing ConsiderationsPage 9Idea of High Density Module:64 lanes(128 DP)64 lanes by 562 pins(12x48)And 2D connector size12345678910111213

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根据《Connector and PCB Routing Study for 448G》报告,主要内容如下: 1. 研究了使用垂直线路卡(VLC)结构进行448G高速PCB布线,包括连接器和高速信号布线。 2. 使用OSFP连接器和垂直安装的ASIC,实现更短的信号布线距离。 3. 研究了不同PCB布线方案(5种方案),比较了插入损耗和通道损耗。 4. 方案2(使用高密度模块直接连接CPC)在74GHz和89GHz下具有最低的插入损耗。 5. 使用超低损耗PCB材料,在74GHz和89GHz下,主PCB损耗可降至10dB以下。 6. 通过优化ASIC与连接器的距离,实现了-10~12dB的主PCB损耗,满足448G传输需求。 7. 下一步将改进连接器和其他组件,提高SI性能,并研究散热结构。
448G传输新突破?" 448G时代性能大揭秘!" 448G传输谁更胜一筹?"
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