专题讨论：探讨下一代计算互连的挑战与解决方案.pdf

1、Understanding the Magnitude of the Interconnect OpportunityAndrew Schmitt Directing Analyst,Cignal AISPECIAL FOCUS:PHOTONICS2www.cignal.ai2 2www.cignal.aiwww.cignal.aiwww.cignal.aiDatacenter Optics Key TechnologiesDatacenter Optics Key Technologies2Electrical I/OPAM4 SignalsDSPDigital Signal Process

2、orClean up electrical/optical signalGenerate optical modulation signalOptical EngineOptical EngineModulates light onto fiberInP,silicon photonics,VCSELs,TFLNLaser,modulator,receiver,amplifiersOptical I/OPAM4 SignalsQSFP,OSFP package400GbE8x50G/lane electrical4x100G/lane optical800GbE8x100G/lane elec

3、trical8x100G/lane opticalNew 4x200G/lane optical1.6TbE8x200G/lane electrical8x200G/lane optical3.2TbE:TBD8x400G/lane electrical PAM-68x400G/lane optical PAM-4Coherent liteOCP EMEA Summit|April 29-30,20253www.cignal.ai3 3www.cignal.aiwww.cignal.aiwww.cignal.ai Interconnect is the bottleneck 2024-insa

4、tiable demand 5.1 million high speed transceivers delivered in 2023 More than 23 million delivered in 2024 The fastest speeds possible 50G/lane(400GbE)peaks in 2025 100G/lane(800GbE)peaks in 2026 200G/lane(1.6TbE)starts shipping this year 400G/lane forecast to start delivery in 2029Compute Wants the

5、 Fastest Speeds it Can GetCompute Wants the Fastest Speeds it Can Get3The New NormalOCP EMEA Summit|April 29-30,2025Moderator:Andrew Schmitt Cignal AIPanelists:Duncan Roweth HPE Ben Lee-NVIDIA Maxim Kuschnerov Huawei George Zervas-Oriole NetworksPanel:Discussing the Challenges and Solutions for Next

6、 Generation Computing InterconnectWill compute architectures evolve to accommodate interconnect limitations?Different technical approaches to build next gen interconnectPluggables vs.CPO how does CPO reach market in volume?Competing materia