1、Metasurface fabricationTobias Wenger Jet Propulsion Laboratory,California Institute of TechnologyReviewed and determined not to contain CUI.2024 California Institute of Technology.Government sponsorship acknowledged.jpl.nasa.govOutline Microfabrication 101 Patterning(lithography)Material deposition(

2、evaporation,sputtering,atomic-layer deposition)Material removal(etching)(Surface preparation,surface cleaning,handling,dicing,material interactions)Metasurface fabrication examples Challenges Material selection Resolution and Aspect Ratio More challenges.Reviewed and determined not to contain CUI.20

3、24 California Institute of Technology.Government sponsorship acknowledged.jpl.nasa.govPatterning-microlithography“Make or break bonds in a resist.”Photo-lithography vs electron-beam lithographyresistsubstrateexposedevelopresistsubstrateexposedevelopExposed area removed “positive resist”Exposed area

4、remains “negative resist”Reviewed and determined not to contain CUI.2024 California Institute of Technology.Government sponsorship acknowledged.jpl.nasa.govDeposition“Adding material”evaporationsputteringatomic-layer deposition(ALD)chemical vapor deposition(CVD)Less conformalMore conformalwaferRevie

5、wed and determined not to contain CUI.2024 California Institute of Technology.Government sponsorship acknowledged.jpl.nasa.govEtching“Removing material”Wet etch vs dry(plasma)etch Isotropic vs anisotropic SelectivityisotropicanisotropicReviewed and determined not to contain CUI.2024 California Insti

6、tute of Technology.Government sponsorship acknowledged.jpl.nasa.govMetasurface fabrication Example 1Silicon metasurface photoresist masksilicon substrateresistexposeReviewed and determined not to contain CUI.2024 California Institute of Technology.Government sponsorship acknowledged.jpl.nasa.govExam