14.30 Glenn Lamming - CPI.pdf

1、Copyright 2023 Centre for Process Innovation Limited trading as CPI.All rights reserved.Microelectronic adhesives:biobased resins and debondability to enable a sustainableelectronics why?future?Dr Glenn LammingSenior Research ScientistREFORM project has received funding from the European Unions Hori

2、zon Europe research and innovation programme under Grant Agreement N 101070255https:/www.reform-project.eu235Project REFORMPrinted electronics for the circular economy“Address the environmental and sustainability challenges around conventional surface mounted and embedded functional electronics.”pRi

3、nted Electronics FOR the circular econoMy6Sustainable debondable adhesivesConductive inksFlexible substratesIntegration into functional electronics systemsMaterial recovery and life cycle assessmentshttps:/www.reform-project.euBiobased resins for microelectronic adhesivesExceptional adhesive strengt

4、h could be realised with biobased epoxy resinsGood retention of strength under heating:60%compared to 65%Good retention of strength after environmental conditioning(85%rH/85 C,72 hours):45%compared to 85%Challenges:Resin purity ionic contentResin VOC-outgassing during adhesive cureReactive group equ

5、ivalenceBiobased contentStriving for 100%?LCA are they more sustainable?7Debondable microelectronic adhesivesHigh performance microelectronic adhesives are crosslinked thermosets:Irreversible chemistries=nothing like solderRemoval requires solvents,pyrolysis,grinding,shredding etc.For REOFRM,CPI des

6、igned microelectronic adhesives to debond-on-demand using several strategies:Expanding particlesThermally softening resinsChemically cleavable bondsThere were challenges finding compatibility between:Adhesive curing(exothermic)and debonding stimuliDesired perf