20250123_K-7_Grossner.PDF

1、Open Compute ProjectThe OCP Open Chiplet Economy Marketplace Opens its DoorsChiplet Summit KeynoteThursday,January 23rd11:30-12:00PM Cliff Grossner,Ph.D.Cliff Grossner,Ph.D.,Chief Innovation Officer,OCPAnu RamamurthyAnu Ramamurthy,OCP Project Co-Lead,OCPConnect.Collaborate.Accelerate.Community-drive

2、n hyperscale innovation for allOCP Meeting the Market and Shaping the FutureOPEN INNOVATION Hyperscale-proven designs Trusted IP model Specs,best practices Rapid technology adoption Multi-vendor ecosystems Future technologiesCOMMUNITYHyperscale CentricConnect.Collaborate.Accelerate.Community-driven

3、hyperscale innovation for allBy Fostering an Open Chiplet Economy3Connect.Collaborate.Accelerate.Community-driven hyperscale innovation for all Which Needs New Integration within the Silicon Supply ChainFactors Brought Forward Adding Complexity Functional Modularity Physical Modularity D2D Interconn

4、ect Packaging Test and Operations Inventory Connect.Collaborate.Accelerate.Community-driven hyperscale innovation for all.While We Have Made Progress on Chiplet AdoptionBroad Ecosystem Solutions Are NextSingle Vendor SolutionSingle Vendor SolutionWhat:What:All components controlled&optimized by a si

5、ngle companyHow:How:can use proprietary solution;no standards neededI/O Hub (7 nm)DDR MemSerDesCPU(5nm)D2DD2DD2DAI Accel(5nm)D2DBroad Ecosystem SolutionsBroad Ecosystem SolutionsWhat:What:“Any”Chiplet can plug in“anywhere”How:How:Many aspects standardized;minimal prior coordination neededI/O Hub(7 n

6、m)DDR MemDDR MemSerDesCPU(5nm)D2DD2DD2DGPU (5nm)D2DI/O Hub(12 nm)DDR MemDDR MemSerDesMore IO D2DD2DD2DDSP (16 nm)D2DI/O Hub (7 nm)DDR MemSerDesCPU(4nm)D2DD2DD2DAI Accel(5nm)D2DI/O Hub (7 nm)DDR MemSerDesRadio(5nm)D2DD2DD2DRadio(5nm)D2DMultiMulti-Vendor SolutionVendor SolutionWhat:What:SoC products t