Xperi Corporation (XPER) 2009年年度报告「NASDAQ」.pdf

1、1 billion plus units today to over 3 billion units in five years.We receive revenue from products and services and through license fees and royalties from two types of intellectual property(IP):infrastructure IP,consisting of our wafer-level packaging and optics technologies;and design-in IP,which i

2、ncludes our optical and embedded image enhancement technologies.Year in reviewIn 2009,Tesseras total revenues were$299.4 million.We signed six new strategic licensees:two in Micro-Electronics and four in Imaging&Optics.We announced licenses with Motorola for our patented Tessera Compli-ant Chip pack

3、aging technology and Kinsus for our PILR interconnect platform.We licensed our wafer-level packaging IP and know-how to JCAP,our wafer-level optics technology to Qtech,our extended depth of field(EDOF)technology to AzureWave,and our face tracking technology to Samsung Electronics.On the R&D front,we

4、 developed one of the industrys first 3 megapixel wafer-level optics solutions that integrates EDOF,extended our EDOF and ultrafast lens solutions to support resolutions of up to 14 megapixels,and announced face recognition technology which performs automatic identification of specific human faces i

5、n camera-enabled devices.One area in which we made considerable progress in our pipeline of innovation was thermal management,with our silent air cooling technology.We developed working models that overcame major technical challenges.Today we are engaged in technology evaluations with two major OEMs

6、,conducting feasibility studies and demonstrating prototypes.We expect to reach key product development milestones for initial commercialization by the end of 2010.We ended 2009 with over$400 million in cash,cash equivalents and investments and zero debt.Our strong balance sheet will provide the fou