利用单相电介质流体打破芯片级冷却的壁垒（冷却功率高达1kW及以上）.pdf

1、Dr Jasper Kidger,Head of ThermoFluids,Iceotope Technologies LtdDr Kelley Mullick,VP of Technology Advancement and Alliances,Iceotope Technologies LtdBreaking the barrier-Chip Level Cooling up to and Beyond 1kW with single phase dielectric fluidLiquid Cooling Technology LandscapeAI demands IT with hi

2、gher TDP(thermal design power)and increased ability to cool at chip level Case for Liquid cooling is provenBut how future-proof are the different liquid cooling strategies?AI is changing the technology landscapeFigure 1 source:ASHRAE White Paper-Emergence and Expansion of Liquid Cooling in Mainstrea

3、m Data CentersFigure 1:Air cooling vs liquid cooling,transitions,and temperaturesHeatsink design forces dielectric coolant through matrix of pinsForced convection benefits of water cooling.The solution is sustainable with:up to 40%reduction in datacenter OpEX Fluid is 0 GWP,non-toxic,and reusable,Re

4、duced carbon footprint due to ability to support more compute/sq.mUp to 100%removal of heat with ability to reuseSolution DesignTest Setup to Support 1kW+Chip Level CoolingIntel“Airport Cove”TTV (4th Gen/Sapphire Rapids)Allows TDP 350W of todays processors Dielectric Coolant(Shell S3X)Controlled and

5、 Measured Flowrates up to 9 l/minControlled input temperatures up to 40COutputsTcase of CPU(thermocouple on TTV)Tbase of Heatsink(thermocouple on heatsink)Lab ValidationDielectric SupplyReturn to Pump4 segments of Airport Cove Die are evenly heatedLab HRU chiller via PHE gives stable dielectric temp

6、For 1kW tests,safety screens needed for DCVTest Setup in Iceotope LabPSUs“Chiller”HRUHExPump and FlometerHSk TestResults of the 1kW+PLC Chip Level Cooling1kW Test PerformanceKey performance findings:At a flow rate of 7.01 l/min,Iceotopes copper pinned KUL SINK achieved a thermal