ESPAS:2022全球半导体趋势和欧盟芯片能力的未来报告(英文版)(17页).pdf

编号:168031 PDF  中文版  DOC 17页 1.58MB 下载积分:VIP专享
下载报告请您先登录!

ESPAS:2022全球半导体趋势和欧盟芯片能力的未来报告(英文版)(17页).pdf

1、Disclaimer This publication was prepared by the European Parliamentary Research Service(EPRS)in the context of the forthcoming European Strategy and Policy Analysis System(ESPAS)Global Trends Report to be published in 2024.This publication does not bind,nor may be attributed to,any of the European U

2、nion institutions and bodies participating in ESPAS,namely the European Commission,the European Parliament,the General Secretariat of the Council of the EU and the European External Action Service,as well as the Committee of the Regions,the European Economic and Social Committee,the European Investm

3、ent Bank,the European Court of Auditors and the European Union Institute of Security Studies.Acknowledgements The ESPAS Ideas Papers have benefited from valuable feedback received from colleagues from across all EU institutions who participated in a series of ESPAS Ideas events throughout 2022.Globa

4、l Semiconductor Trends and the Future of EU Chip Capabilities Author:Kjeld van Wieringen Table of content The European Chips Act The EUs position in the global semiconductor value chain Global industry trends Global policy trends Potential futures for 2030 SUMMARY The proposed European chips act,pre

5、sented by the European Commission in February 2022,aims to mobilise 43 billion in policy-driven investment for the EUs semiconductor sector by 2030.The Commission expects long-term private investment to exceed this.The plan serves to enable immediate EU coordination against supply disruptions,streng

6、then and scale up production and innovation throughout the EU semiconductor value chain,and further enhance the Unions technological leadership,practical applications and digital sovereignty in this crucial field.The global semiconductor value chain is characterised by chokepoints and critical depen

友情提示

1、下载报告失败解决办法
2、PDF文件下载后,可能会被浏览器默认打开,此种情况可以点击浏览器菜单,保存网页到桌面,就可以正常下载了。
3、本站不支持迅雷下载,请使用电脑自带的IE浏览器,或者360浏览器、谷歌浏览器下载即可。
4、本站报告下载后的文档和图纸-无水印,预览文档经过压缩,下载后原文更清晰。

本文(ESPAS:2022全球半导体趋势和欧盟芯片能力的未来报告(英文版)(17页).pdf)为本站 (Kelly Street) 主动上传,三个皮匠报告文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知三个皮匠报告文库(点击联系客服),我们立即给予删除!

温馨提示:如果因为网速或其他原因下载失败请重新下载,重复下载不扣分。
客服
商务合作
小程序
服务号
折叠