High-speed IO Trends for Hyperscale - Innovation Opportunities.pdf

1、High-speed IO Trends for Hyperscale:Innovation OpportunitiesIT Ecosystem:Server&StorageHigh-speed IO Trends for Hyperscale:Innovation OpportunitiesMajid Foodeei,Director of Standards,Kandou BusArmin Tajalli,VP of Advanced R&D,Kandou BusHyper-Scale Compute&Higher Speed IO TrendsSource:IBSSource:CSSS

2、Talk Jshalflbl.govSource:IEA.orgMaintaining performance requires innovation in all aspects of technologyChiplet and Higher Speed Chiplet Interconnect Robust,high-performance,low-power and low-cost Chiplet demands continuous innovationOCP and other Chiplet StandardsBoW 2.0 32 Gbps/WireUCIe 1.0 32 Gbp

3、s/WireUSR 58 Gbps/Wire(CEI-112:58 CNRZ)ACC 1.0 32-128 Gbps/WireACCAdvanced Cost-driven Chiplet InterfaceOIF XSR/XSR+also used forCo/Near Package OpticsStandard and Advanced(2.5D and 3D)PackageOIF USR(CEI-5.0,112G+,CNRZ)with 40G/58G per wire,with 2D packagesRoadmap:Double speedUCIe,with 16G/32G per w

4、ire for 2D,2.5DOCP BOW 2.0 with data rates of up to 16G/32G per wire for 2D and 2.5D packages.New ACC 1.0(advanced cost-driven Chiplet)targets 32-128 Gbps/Wire.1)B.B.Dehlaghi Jadid,“Ultra Short Reach Die-to-Die Links”,University of Toronto,https:/tspace.library.utoronto.ca/handle/1807/808312)Synpsys

5、 Packaging Blog https:/ and FOMsRateBER(w/wo EC)LatencyLow powerEdge densityArea densityReachCost(Std./Adv.)Solution FOM:THE RIGHT TRADE-OFFSoln-ASoln-BSoln-CStandard Mode*Rate G/s/pinReach mmPower pJ/bLatencynsEdge BW Tb/s/mmBump mBER RawOIF USR5825NS2NS1301E-15UCIe32 Std.32250.52 1.81301E-15 BoW-5

6、12 Std32250.52 1.01301E-15 UCIe32 Adv.3220.25210.5451E-15 BoW-512 Adv.3220.2525.1451E-15 PackageLaminateAdvancedTerminationDoubleNoneBoW ModeWire Bit RateReachReach(Gbps/wire)(mm)(mm)BoW-32225+4BoW-64425+2BoW-128825+2BoW-2561625+2BoW-3842425+2BoW-5123225+2ENERGYSI AREALATENCYISIXTALKCMNSSNDATA RATEI