打破开放芯片普及的现实障碍.pdf

1、Kash JohalCEO,YorChip IncBreaking real world barriers forOpen Chiplet AdoptionBreaking real world barriers for Open Chiplet AdoptionKash Johal,CEO YorChip Inc.SERVER:OPEN CHIPLETECONOMYChiplet Availability&Interoperability(or lack of it)limits End User AdoptionDevelopers face:Uncertain Market as 3-4

2、 standards UCIe-S,UCIe-A,UCIe-3D,Bow etc all incompatibleLicensing costs of PHY is expensive Millions of Dollars need to reduce for MPWPackaging dev and prototyping costs are TOO HIGH Interoperability issues wrong PHY could mean no salesLimited Market data to build ROI and business caseRapidly chang

3、ing packaging costs and availability complicate ROI and PHY decisionUsers face:Availability-Very few Chiplets they can buy todayUnderstanding KGD and guarantees on Chiplet yields in package and fieldEcosystems that help assure interoperability are just now starting outReal world barriers to Open Chi

4、plet Adoption Business Group-Virtual Prototyping for a thriving multi-vendor chiplet ecosystem Enabling virtual prototyping to validate interoperability and designOCP Market Place Chiplet Listings,Training,White Papers,https:/www.opencompute.org/chipletsChiplet Silicon Systems group looking into Sec

5、urity,Management,RAS of complete Chiplet based systems.Calliptra Security Great OCP project that can also be applied to secure Chiplet systems.This is an open-source effort supported by hyperscalers for Data center market.4 key Current OCP activities to ease adoptionMajor challenge for Open Chiplets

6、 especiallywith Advanced packaging.Wafer probe testingis not possible for tight bump pitches 50u.Die should be stressed and fully speed tested at Die Level.Identify early life mortality and assure minimal field failures.Simple digital loop back testing is inadequate.Speed testing,Voltage&Temp stress