1、https:/ for ParticipationAccelerating Early-Stage Exploration with Virtual Prototyping for a Flourishing Multi-Vendor Chiplet Economy;https:/bit.ly/47Xge6BKickstart chiplet virtual eco-systemsFrontendModels&Stimuli DesignBackendSSSMMMMMMSpecs&DocsSHIFTLEFTMULTI-ORG,MULTI-DIECHIPLETECO-SYSTEMSMULTI-O
2、RG,MULTI-DIECHIPLETVIRTUALECO-SYSTEMShttps:/bit.ly/47Xge6BMarkets,Technologies,and Products proliferation of needs&options;https:/bit.ly/47Xge6BSource:“AI Chips for Data centers and cloud 2025-2035,Technologies,Markets,Forecasts”June 2025,IDTechExArch variants:Evaluate technical and business value f
3、or decision analysis1234Source:“Modular High-Performance Computing Using Chiplets”,Bapi Vinnakota and John M.Shalf,Lawrence Berkeley National Laboratory,Nov 2023,IEEE Computer Soc,CS&Ehttps:/bit.ly/47Xge6BNext wave of multi-organization eco-systems addressing diverse market needshttps:/bit.ly/47Xge6
4、BIdentifying vendors and specific designs for architecture interoperability evaluationsValidating arch.Interoperability of dies/chipletsTime intensive and variable processLack of best practices&reference designs variable outcomesLack of well-accepted value prop perf,power,area,and costIdentify gaps
5、or lack of offeringsProblems&Opportunities in early stages of Multi-organization,Multi-die/chiplets Design cycle;https:/bit.ly/47Xge6BFront-End FlowDesign ImplementationBackend FlowPlanningArch Design&PartitioningPrototyping&Functional SimulationPrelim Power/Perf/Cost analysisBenefits:Improve produc
6、t-market fit,Faster time to revenue,and Lower NRE8Vendor Neutral frameworkMonetize Larger eco-systemAutomate&ScaleValue prop PPAC on MVPPBest PracticesReference DesignsIdentify Gaps for$Arch.Interoperability1.Vendor-neutral Framework for discovering interoperable designs Accelera