下一代人工智能服务器的机架架构.pdf

1、Rack Architecture for Next Generation AI ServerFoxconn/IngrasysRack Architecture for Next Generation AI ServerChris PaiEngineering VP/IngrasysRACK&POWERData Center Power and Cooling Solution TrendCRPS+Air Cooled2000 2000-201020101990 1990-200020002010 2010-201520151-3kW5-10kW8-20kW2026 2026 300+kWPo

2、wer Rack+Fully Liquid CooledPower Shelf+Liquid/Air Hybrid Cooled2016 2016-202020202021 2021-202320232024 2024-2025202550+kW120+kW30kW Computing power rises rapidly during AI generation that hit air-cooling limitation.Increase the computing performance and lower the investment costs for space.Conside

3、ration for Next Generation AI ServerAir cooling limitation Better thermal efficiency to get lower power usage effectiveness of datacenter.Increase the heat load/power density upper limit per rack.Why Liquid Cooling?CDU(L2L)CDU(L2A)Piping Arrangement and TemperatureTypical Datacenter Hall Layout Liqu

4、id Cooled45-55deg C25-35deg C35-45deg CHeat Rejection(Cooling Tower/Dry Cooler)20-30deg CInfrastructure Requirement for AI Rack/ClusterLiquid to AirNo need facility waterLow cooling capabilitySidecar(Liquid to Air)IT RackSidecar(Liquid to Air)IT RackSidecar(Liquid to Air)IT RackLiquid to LiquidFacil

5、ity water requiredHigh cooling capabilityIn-row CDU(Liquid to Liquid)IT RackRack Architecture for Next Generation AI ServerCooling BankAI Rack with Power SidecarDiabloDiabloDiabloKey Considerations of The Three Building BlocksRack Architecture for Next Generation AI ServerHigh Density AI RackPower S

6、idecarCooling Bank High Power Consumption Full Liquid-cooled(Single Phase DLC and Two Phase DLC)High Density Good Serviceability High Power(Higher Power Capacity,High DC Voltage Management)Liquid-cooled Busbar Effective Power Distribution S